Analysis of Structure of Metallized Composites Used in Flexible Conductor Technology Based on Carbon Fiber and Methyl Methacrylate Adhesive Composition with Silicone Sealant

Abstract

This paper establishes the mechanism of interaction at the phase interface during electrochemical copper plating of a carbon fiber-based composite with an adhesive mixture of methyl methacrylate and silicone sealant. The influence of galvanic copper plating parameters on the metallized composite’ structure and properties is demonstrated. Thus, at an electrolysis current density of 50 mA/cm², a high-quality coating of required thickness with the best microhardness, adhesion, and electrical resistivity can be obtained.