Interface Modification of Quantum Dots Altering Electrical Characteristics of PP-Composites for HVDC Cable Insulation

IF 4.3 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Heyu Wang, Zhonglei Li, Zechao Yang, Boxue Du
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Abstract

Polypropylene (PP) insulation for HVDC cables faces critical challenges under combined high-temperature and high-field conditions, including elevated conductivity and electric field distortion. To elucidate the role of interfacial structure engineering in governing carrier confinement mechanisms, three PP composites were developed, incorporating bare CdSe quantum dots (QDs), silane-modified CdSe@KH570 QDs and CdSe@ZnS core–shell QDs, each at 0.10 wt% loading. At 90°C, PP/CdSe@ZnS achieves a characteristic breakdown strength of 284.9 kV/mm with 44.8% enhancement and exhibits an 87.5% reduction in conductivity, significantly outperforming other modifications. Thermally stimulated depolarisation current measurements reveal that core–shell quantum dots introduce deep trap levels at 1.06 eV compared to 1.02 eV for bare CdSe composites. Interfacial potential barrier and carrier probability distribution analysis demonstrate that the inorganic ZnS shell creates high-barrier double confinement for both electrons and holes with spatial separation that minimises recombination. In contrast, the valence band energy of the organic KH570 coating closely matches that of CdSe, resulting in hole wavefunction extension into the organic layer and substantial electron–hole overlap that increases recombination probability. These findings demonstrate that interfacial engineering through inorganic core–shell architectures provides optimal carrier confinement for next-generation HVDC cable insulation operating under demanding electrothermal conditions.

量子点界面修饰改变高压直流电缆绝缘pp -复合材料电特性
高压直流电缆的聚丙烯(PP)绝缘在高温和高场强条件下面临着严峻的挑战,包括电导率升高和电场畸变。为了阐明界面结构工程在控制载子约束机制中的作用,研究人员开发了三种PP复合材料,包括裸CdSe量子点(QDs)、硅烷修饰的CdSe@KH570量子点和CdSe@ZnS核壳量子点,每种负载为0.10 wt%。在90°C时,PP/CdSe@ZnS的击穿强度达到284.9 kV/mm,增强44.8%,电导率降低87.5%,显著优于其他改性材料。热激发退极化电流测量表明,核壳量子点引入的深阱能级为1.06 eV,而裸CdSe复合材料的深阱能级为1.02 eV。界面势垒和载流子概率分布分析表明,无机ZnS壳层对电子和空穴都产生了高势垒双约束,空间分离使复合最小化。相比之下,有机KH570涂层的价带能与CdSe的价带能密切匹配,导致空穴波函数延伸到有机层中,大量的电子-空穴重叠增加了复合概率。这些发现表明,通过无机芯壳结构的界面工程为在苛刻的电热条件下运行的下一代高压直流电缆绝缘提供了最佳的载流子约束。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
IET Nanodielectrics
IET Nanodielectrics Materials Science-Materials Chemistry
CiteScore
5.60
自引率
3.70%
发文量
7
审稿时长
21 weeks
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