Full-color high brightness Micro-LED displays with high bonding yield realized via photosensitive conductive polymeric bumps

IF 7.7 2区材料科学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY

Science China Materials Pub Date : 2026-07-03 DOI:10.1007/s40843-025-4009-0

Qian Liu (, ), Xinrui Huang (, ), Xin Wu (, ), Jinkun Jiang (, ), Xin Lin (, ), Shuaishuai Wang (, ), Taifu Lang (, ), Peiquan Zheng (, ), Chang Lin (, ), Jie Sun (, ), Xiao Li (, ), Xiongtu Zhou (, ), Qun Yan (, )

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引用次数: 0

Abstract

Micro light-emitting diode (Micro-LED) display technology is regarded as a promising next-generation display technology due to its advantages of high brightness, high contrast, low power consumption, long life, and fast response. However, with the aggressive downscaling of Micro-LED size to only a few microns, when the pixel density is high, the lift-off fabrication of metal bumps used as the soldered joints between the Micro-LEDs and the driver substrate becomes increasingly difficult. Therefore, achieving a high-yield bump array becomes challenging under high-density conditions. In this study, we innovatively use a photosensitive conductive polymer (PCP) to replace conventional metal bumps, serving as a new bonding material between Micro-LEDs and the driving substrate, which can be used to fabricate polymeric micro-bump arrays through well-established photolithography, elegantly bypassing the complex lift-off process in the preparation of traditional metal bumps, and yet keeping a low risk of short circuits. We innovatively use isopropyl alcohol to regulate the wettability of the developer to obtain the best development effect and prepare bump arrays with a bump size of 20 µm × 12 µm and a height of (1.9288 ± 0.0213) µm on thin-film transistor drivers (TFTs) with a yield of over 99.99%. In addition, we successfully resolved the issue of low bonding yield resulting from polydimethylsiloxane (PDMS) thermal expansion, achieving a bonding yield exceeding 99.8%, and a 0.99-inch full-color Micro-LED display with a density of 114 pixels per inch (PPI) and a display brightness of 5537 cd/m² was successfully prepared. It is noteworthy that the high-yield bump arrays and Micro-LED arrays, as well as their high bonding yield, are highly reproducible, which can promote the development of Micro-LED displays and related fields.

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利用光敏导电聚合物凸点实现高成键率的全彩高亮度Micro-LED显示屏

微发光二极管（Micro- led）显示技术以其高亮度、高对比度、低功耗、长寿命、快速响应等优点被认为是下一代显示技术的发展方向。然而，随着Micro-LED尺寸的急剧缩小到只有几微米，当像素密度很高时，用作Micro-LED和驱动衬底之间焊接接头的金属凸起的提升制造变得越来越困难。因此，在高密度条件下实现高产量凸点阵列变得具有挑战性。在这项研究中，我们创新地使用光敏导电聚合物（PCP）来取代传统的金属凸点，作为微型led与驱动衬底之间的新型键合材料，可以通过完善的光刻技术来制造聚合物微凸点阵列，巧妙地绕过了传统金属凸点制备过程中复杂的提升过程，同时保持了低短路风险。我们创新地使用异丙醇调节显影液的润湿性，以获得最佳显影效果，并在薄膜晶体管驱动器（TFTs）上制备了凹凸尺寸为20µm × 12µm，高度为（1.9288±0.0213）µm的凹凸阵列，收率超过99.99%。此外，我们成功解决了聚二甲基硅氧烷（PDMS）热膨胀导致的成键率低的问题，实现了超过99.8%的成键率，并成功制备了密度为114像素/英寸（PPI），显示亮度为5537 cd/m2的0.99英寸全彩Micro-LED显示屏。值得注意的是，高良率凸点阵列和Micro-LED阵列及其高键合良率具有高度可重复性，可促进Micro-LED显示及相关领域的发展。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Science China Materials Materials Science-General Materials Science

CiteScore

11.40

自引率

7.40%

发文量

949

期刊介绍： Science China Materials (SCM) is a globally peer-reviewed journal that covers all facets of materials science. It is supervised by the Chinese Academy of Sciences and co-sponsored by the Chinese Academy of Sciences and the National Natural Science Foundation of China. The journal is jointly published monthly in both printed and electronic forms by Science China Press and Springer. The aim of SCM is to encourage communication of high-quality, innovative research results at the cutting-edge interface of materials science with chemistry, physics, biology, and engineering. It focuses on breakthroughs from around the world and aims to become a world-leading academic journal for materials science.