3D-printed penetrating neural probes with maskless metallization and encapsulation

IF 5.2 Q2 ENGINEERING, MANUFACTURING
Additive manufacturing letters Pub Date : 2026-07-01 Epub Date: 2026-07-19 DOI:10.1016/j.addlet.2026.100408
Armin Sedighi, Mehedi Hasan, Xiaoce Feng, Yong Xu
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引用次数: 0

Abstract

Three‑dimensional (3D) printing offers new design freedoms for neural interfaces, but reliable metallization and selective encapsulation on complex geometries remain challenging. We present a fully 3D-printed penetrating neural probe fabricated by two-photon polymerization, enabled by two maskless approaches: trench-guided metal deposition via line-of-sight evaporation to define electrodes and interconnect traces, and capillary-driven SU-8 encapsulation, which self-limits at convex edges to preserve exposed electrode sites. The resulting probe incorporates a 2-mm shank with four mushroom-shaped electrodes and demonstrates robust metallization, reliable electrical isolation, and controlled encapsulation achieved purely through geometric design without lithographic masking. Electrochemical characterization confirmed the functionality and integrity of the electrodes, while mechanical testing in 0.6% agarose gel confirmed sufficient buckling resistance for insertion. This approach provides a rapid, maskless, and highly customizable route for fabricating penetrating neural probes. More broadly, this approach establishes a scalable, geometry-driven paradigm for functionalizing complex 3D-printed microstructures, extending beyond neural interfaces to a wide range of bioelectronic and microscale devices.
无掩模金属化和封装的3d打印穿透性神经探针
三维(3D)打印为神经接口提供了新的设计自由,但可靠的金属化和复杂几何形状的选择性封装仍然具有挑战性。我们提出了一种完全3d打印的穿透性神经探针,由双光子聚合制造,通过两种无掩膜方法实现:通过视线蒸发的沟槽引导金属沉积来定义电极和互连痕迹,以及毛细管驱动的SU-8封装,其在凸边自我限制以保留暴露的电极位置。由此产生的探针包含一个2毫米的手柄和四个蘑菇形电极,并展示了强大的金属化,可靠的电隔离,以及完全通过几何设计实现的可控封装,而不需要光刻掩蔽。电化学表征证实了电极的功能性和完整性,而在0.6%琼脂糖凝胶中进行的力学测试证实了电极具有足够的抗屈曲性。这种方法为制造穿透性神经探针提供了一种快速、无掩模和高度可定制的途径。更广泛地说,这种方法建立了一个可扩展的、几何驱动的范例,用于实现复杂的3d打印微结构的功能化,从神经接口扩展到广泛的生物电子和微型设备。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Additive manufacturing letters
Additive manufacturing letters Materials Science (General), Industrial and Manufacturing Engineering, Mechanics of Materials
CiteScore
3.70
自引率
0.00%
发文量
0
审稿时长
37 days
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