Fuping Li;Ding Yuan;Yujie Wang;Juelei Zhou;Xihao Liang;Yinhe Han;Huawei Li;Xiaowei Li;Ying Wang
{"title":"Chipletizer 2.0: Toward Cost-Effective Chiplet Design via Reuse-Aware Decomposition","authors":"Fuping Li;Ding Yuan;Yujie Wang;Juelei Zhou;Xihao Liang;Yinhe Han;Huawei Li;Xiaowei Li;Ying Wang","doi":"10.1109/TCAD.2025.3602743","DOIUrl":null,"url":null,"abstract":"The decomposition-based chiplet design paradigm, which breaks monolithic system-on-chips (SoCs) into smaller chiplets, has proved effective in reducing costs and accelerating development. The vast design space of multichiplet systems necessitates automated techniques to maximize their benefits while minimizing overheads. However, current chiplet decomposition flows lack support for exploring reusable chiplets, missing opportunities to efficiently amortize nonrecurring engineering (NRE) costs. To fully unleash the economic potential of chiplets, we propose <sc>Chipletizer 2.0</small>, a cost-driven framework that guides SoC decomposition and enables chiplet reuse across a line of products. This early-stage chiplet planning framework determines critical system parameters involving the partition, floorplan, and die-to-die (D2D) interface, based on user-specified optimization goals. Experimental results demonstrate that, compared with the existing chiplet decomposition techniques, our proposed framework achieves significant cost improvements on realistic product lines with acceptable overheads.","PeriodicalId":13251,"journal":{"name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","volume":"45 4","pages":"1584-1597"},"PeriodicalIF":3.6000,"publicationDate":"2026-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","FirstCategoryId":"94","ListUrlMain":"https://ieeexplore.ieee.org/document/11142315/","RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"2025/8/26 0:00:00","PubModel":"Epub","JCR":"Q2","JCRName":"COMPUTER SCIENCE, HARDWARE & ARCHITECTURE","Score":null,"Total":0}
引用次数: 0
Abstract
The decomposition-based chiplet design paradigm, which breaks monolithic system-on-chips (SoCs) into smaller chiplets, has proved effective in reducing costs and accelerating development. The vast design space of multichiplet systems necessitates automated techniques to maximize their benefits while minimizing overheads. However, current chiplet decomposition flows lack support for exploring reusable chiplets, missing opportunities to efficiently amortize nonrecurring engineering (NRE) costs. To fully unleash the economic potential of chiplets, we propose Chipletizer 2.0, a cost-driven framework that guides SoC decomposition and enables chiplet reuse across a line of products. This early-stage chiplet planning framework determines critical system parameters involving the partition, floorplan, and die-to-die (D2D) interface, based on user-specified optimization goals. Experimental results demonstrate that, compared with the existing chiplet decomposition techniques, our proposed framework achieves significant cost improvements on realistic product lines with acceptable overheads.
期刊介绍:
The purpose of this Transactions is to publish papers of interest to individuals in the area of computer-aided design of integrated circuits and systems composed of analog, digital, mixed-signal, optical, or microwave components. The aids include methods, models, algorithms, and man-machine interfaces for system-level, physical and logical design including: planning, synthesis, partitioning, modeling, simulation, layout, verification, testing, hardware-software co-design and documentation of integrated circuit and system designs of all complexities. Design tools and techniques for evaluating and designing integrated circuits and systems for metrics such as performance, power, reliability, testability, and security are a focus.