A Direct-Capacitance-Conversion FeRAM Characterization Platform for Enabling Non-Destructive 3-D Ferroelectric Capacitor Readout

IF 4.6 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Xiongfei Jiang;Chaohan Wang;Yang Xiang;Shiwei Wang;Themis Prodromakis;Marie Garcia Bardon;Jan Van Houdt;Fernando Garcia Redondo;Dwaipayan Biswas
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引用次数: 0

Abstract

Ferroelectric-capacitor-based memory (FeRAM) is a promising emerging non-volatile memory technology that offers fast access and high endurance. Recent studies have demonstrated Ferroelectric-capacitor-based memory (FeRAM) has the potential to support Non-Destructive Readout (NDRO) as well as 3D stacking, enabling read operations that do not disturb or minor disturb the stored polarization state and higher density. However, variations in ferroelectric materials and layer structures lead to diverse hysteresis behaviors, resulting in different sensing requirements. In addition, the reduced capacitor size in deeply stacked 3D architectures further decreases the available charge, making accurate readout increasingly challenging. To better understand these issues, this work presents a highly scalable direct-capacitance-conversion characterization circuit that is capable of extracting the equivalent ferroelectric capacitance from a 3D FeRAM array. Leveraging a continuous-time delta-sigma modulator (CTDSM), the proposed platform can accurately quantize small ferroelectric equivalent capacitances ranging from 0 to 72fF with low noise and high resolution, and achieves a capacitance resolution of $0.045\mathrm {fF_{rms}}$ while consuming only $3\mu $ W power and occupying 0.001mm2 chip area under a 22nm FDSOI technology. These results demonstrate the capability to characterize 3D FeRAM arrays with up to 64 vertically stacked ferroelectric capacitors (FeCAPs) and highlight strong scalability for large-scale FeRAM evaluation and design exploration.
实现非破坏性三维铁电电容读出的直接电容转换FeRAM表征平台
基于铁电电容的存储器(FeRAM)是一种具有快速存取和高耐用性的新兴非易失性存储器技术。最近的研究表明,基于铁电电容的存储器(FeRAM)具有支持非破坏性读出(NDRO)和3D堆叠的潜力,使读取操作不会干扰或轻微干扰存储的极化状态和更高的密度。然而,铁电材料和层结构的变化导致了不同的磁滞行为,从而导致了不同的传感要求。此外,在深度堆叠的3D架构中,缩小的电容器尺寸进一步减少了可用电荷,使准确读出变得越来越具有挑战性。为了更好地理解这些问题,本研究提出了一种高度可扩展的直接电容转换表征电路,该电路能够从3D FeRAM阵列中提取等效铁电电容。利用连续时间δ - σ调制器(CTDSM),该平台可以精确量化0 - 72fF范围内的小铁电等效电容,具有低噪声和高分辨率,在22nm FDSOI技术下,电容分辨率为0.045美元\数学{fF_{rms}}美元,功耗仅为3美元\mu $ W,芯片面积为0.001mm2。这些结果证明了具有多达64个垂直堆叠铁电电容器(fecap)的3D FeRAM阵列的表征能力,并突出了大规模FeRAM评估和设计探索的强大可扩展性。
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来源期刊
IEEE Transactions on Circuits and Systems II: Express Briefs
IEEE Transactions on Circuits and Systems II: Express Briefs 工程技术-工程:电子与电气
CiteScore
7.90
自引率
20.50%
发文量
883
审稿时长
3.0 months
期刊介绍: TCAS II publishes brief papers in the field specified by the theory, analysis, design, and practical implementations of circuits, and the application of circuit techniques to systems and to signal processing. Included is the whole spectrum from basic scientific theory to industrial applications. The field of interest covered includes: Circuits: Analog, Digital and Mixed Signal Circuits and Systems Nonlinear Circuits and Systems, Integrated Sensors, MEMS and Systems on Chip, Nanoscale Circuits and Systems, Optoelectronic Circuits and Systems, Power Electronics and Systems Software for Analog-and-Logic Circuits and Systems Control aspects of Circuits and Systems.
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