Comments on “Experimental Evaluation of Relationship Between Radiofrequency Heating Near Implanted Conductive Devices, Scanner-Reported B1+rms, and Transmit Power”

IF 4.5 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC
IEEE journal of microwaves Pub Date : 2026-03-01 Epub Date: 2026-03-17 DOI:10.1109/JMW.2026.3666625
Michael Steckner;Mark Conroy;Jonathan Edmonson;Tolga Goren
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引用次数: 0

Abstract

In the above article [1] regarding heating near implanted conductive medical devices during MRI, key experimental conditions regarding “RF shimming” parameters are not identified. Therefore, the exact mechanism causing the spread in heating cannot be reliably identified. The likely mechanism is suggested here, and it is noted that the spread in heating results is expected nor relevant, given standard implant testing procedures.
对“植入导电装置附近射频加热与扫描仪报告B1+rms和发射功率关系的实验评估”的评论
在上述关于MRI期间植入的导电医疗设备附近加热的文章[1]中,没有确定有关“射频振荡”参数的关键实验条件。因此,导致加热扩散的确切机制不能可靠地确定。本文提出了可能的机制,并指出,考虑到标准的植入物测试程序,加热结果的传播是不相关的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
CiteScore
10.70
自引率
0.00%
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0
审稿时长
8 weeks
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