HammerBlade in Silicon: A 12-nm 2048-Core RISC-V Manycore SoC With Ruche Networks

IF 3.2 2区 工程技术 Q2 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE
Paul Gao;Dai Cheol Jung;Scott Davidson;Daniel Ruelas-Petrisko;Yuan-Mao Chueh;Max Ruttenberg;Kangli Li;Farzam Gilani;Dustin Richmond;Mark Oskin;Michael Bedford Taylor
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Abstract

This brief presents the 99 mm2, 12-nm FinFET, 2048-core HammerBlade (HB) RISC-V manycore system-on-chip (SoC) which includes the world’s first implementation of Ruche Networks, a wire-maximal network-on-chip (NoC) topology. Prior architecture research argues for HB’s physical and logical scalability, programmability, and high density; this brief shows a concrete realization in silicon. This brief demonstrates strong results running in silicon on 2048 cores over a diverse set of representative parallelized applications, and also a world record on CoreMark (CM) score. This brief further describes in detail the silicon implementation of Ruche Networks. Operating at 1.49 GHz at 0.8 V, the NoC delivers a peak aggregate bandwidth of 2572.6 Tb/s and a bisection bandwidth of 53.2 Tb/s. The design achieves an exceptionally high routing density of 4289 bit/mm. Finally, this brief demonstrates how a small team of Ph.D. students overcame large-chip backend computer-aided design (CAD) challenges using on-chip source-synchronous interconnect (OCSSI), a globally asynchronous locally synchronous (GALS) style top-level integration methodology, combined with a turnaround-time optimized hierarchical design flow.
HammerBlade in Silicon: 12纳米2048核RISC-V多核SoC与Ruche网络
本文介绍了99mm2, 12nm FinFET, 2048核HammerBlade (HB) RISC-V多核片上系统(SoC),其中包括世界上第一个实现的Ruche网络,这是一种线最大的片上网络(NoC)拓扑。先前的架构研究支持HB的物理和逻辑可扩展性、可编程性和高密度;本文简要介绍了在硅上的具体实现。这篇简短的文章展示了在2048个核心的硅片上运行各种代表性并行化应用程序的强大结果,以及CoreMark (CM)分数的世界纪录。本简介进一步详细描述了Ruche Networks的芯片实现。NoC工作在1.49 GHz,工作电压为0.8 V,峰值总带宽为2572.6 Tb/s,平分带宽为53.2 Tb/s。该设计实现了4289 bit/mm的极高布线密度。最后,本简报展示了一个博士生小组如何利用片上源同步互连(OCSSI)、全局异步本地同步(GALS)风格的顶层集成方法,结合周转时间优化的分层设计流程,克服大芯片后端计算机辅助设计(CAD)挑战。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
CiteScore
6.40
自引率
7.10%
发文量
187
审稿时长
3.6 months
期刊介绍: The IEEE Transactions on VLSI Systems is published as a monthly journal under the co-sponsorship of the IEEE Circuits and Systems Society, the IEEE Computer Society, and the IEEE Solid-State Circuits Society. Design and realization of microelectronic systems using VLSI/ULSI technologies require close collaboration among scientists and engineers in the fields of systems architecture, logic and circuit design, chips and wafer fabrication, packaging, testing and systems applications. Generation of specifications, design and verification must be performed at all abstraction levels, including the system, register-transfer, logic, circuit, transistor and process levels. To address this critical area through a common forum, the IEEE Transactions on VLSI Systems have been founded. The editorial board, consisting of international experts, invites original papers which emphasize and merit the novel systems integration aspects of microelectronic systems including interactions among systems design and partitioning, logic and memory design, digital and analog circuit design, layout synthesis, CAD tools, chips and wafer fabrication, testing and packaging, and systems level qualification. Thus, the coverage of these Transactions will focus on VLSI/ULSI microelectronic systems integration.
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