A Highly Accelerated Automatic Transient Field Evaluation in Planar Multilayered Structures

IF 2.6 3区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
Giampiero Lovat
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引用次数: 0

Abstract

An automatic numerical scheme is presented for accelerated time-domain evaluation of electromagnetic fields radiated by elementary sources in planar multilayered structures. The formulation is based on the inverse Fourier transform of Sommerfeld-type integrals. The latter are evaluated by a partition–extrapolation method using an automatic generalized weighted-averages algorithm for semi-infinite tails, while the inverse Fourier transform is carried out semianalytically by adaptive cubic-spline interpolation of the field spectrum and closed-form integration of each spline segment. Once the spectral kernel is known, the integration parameters are selected automatically, including decay-exponent estimates for the tail acceleration and a multicriterion frequency-truncation strategy. Numerical examples involving vertical electric and magnetic dipoles, nondispersive and dispersive layers are used to assess accuracy, robustness, computational cost, and acceleration.
平面多层结构的高加速瞬态场自动评估
提出了一种用于平面多层结构中基源辐射电磁场加速时域计算的自动数值格式。该公式基于索默菲尔德型积分的傅里叶反变换。后者采用半无限尾的自动广义加权平均算法的分块-外推法进行计算,而傅里叶反变换则采用自适应三样条场谱插值和每个样条段的封闭积分进行半解析。一旦谱核已知,积分参数自动选择,包括尾部加速度的衰减指数估计和多准则频率截断策略。涉及垂直电偶极子和磁偶极子、非色散层和色散层的数值示例用于评估准确性、鲁棒性、计算成本和加速度。
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来源期刊
CiteScore
4.80
自引率
19.00%
发文量
235
审稿时长
2.3 months
期刊介绍: IEEE Transactions on Electromagnetic Compatibility publishes original and significant contributions related to all disciplines of electromagnetic compatibility (EMC) and relevant methods to predict, assess and prevent electromagnetic interference (EMI) and increase device/product immunity. The scope of the publication includes, but is not limited to Electromagnetic Environments; Interference Control; EMC and EMI Modeling; High Power Electromagnetics; EMC Standards, Methods of EMC Measurements; Computational Electromagnetics and Signal and Power Integrity, as applied or directly related to Electromagnetic Compatibility problems; Transmission Lines; Electrostatic Discharge and Lightning Effects; EMC in Wireless and Optical Technologies; EMC in Printed Circuit Board and System Design.
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