Silicone Materials Intended for the Protection and Sealing of Microelectronics and Electronic Equipment

IF 0.58 Q4 Materials Science

Polymer Science, Series D Pub Date : 2026-06-24 DOI:10.1134/S1995421226700218

O. V. Neelova

引用次数: 0

Abstract

This article presents a review of research results on the physicochemical properties and applications of foreign and domestic organosilicon polymer materials designed to protect and seal micro- and nanoelectronics and electronic products.

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用于保护和密封微电子和电子设备的硅酮材料

本文综述了国内外用于保护和密封微纳电子和电子产品的有机硅高分子材料的理化性质及其应用的研究成果。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Polymer Science, Series D Materials Science-Polymers and Plastics

CiteScore

0.80

自引率

0.00%

发文量

期刊介绍： Polymer Science, Series D publishes useful description of engineering developments that are related to the preparation and application of glues, compounds, sealing materials, and binding agents, articles on the adhesion theory, prediction of the strength of adhesive joints, methods for the control of their properties, synthesis, and methods of structural modeling of glued joints and constructions, original articles with new scientific results, analytical reviews of the modern state in the field.