An EME-Reduced FlexRay Transmitter Architecture Employing a Common-Mode Feedback Control

IF 2.6 3区计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Transactions on Electromagnetic Compatibility Pub Date : 2026-10-01 Epub Date: 2026-06-17 DOI:10.1109/TEMC.2026.3699374

Hamid Sadat Mansoury;Saeed Saeedi;Mojtaba Atarodi

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引用次数: 0

Abstract

In this article, a FlexRay transmitter circuit topology is presented that surpasses stringent electromagnetic emission (EME) requirements in automotive applications. The proposed method, implemented in a 180 nm Bipolar-CMOS-DMOS (BCD) process, employs high-voltage devices in the output stage together with a common-mode (CM) feedback mechanism to effectively suppress CM emissions and to ensure robustness against ±40 V disturbances. An all-pass sensing circuit is introduced to maintain loop stability, and a detailed stability analysis is provided, relating circuit parameters to the loop behavior, including the unity-gain frequency and phase margin. Postlayout simulations confirm compliance with FlexRay specifications across process corners, supply-voltage, and temperature variations. Compared to previous works, substantial EME reduction is achieved, particularly in the MHz range, where excessive emissions can interfere with nearby nodes, even those operating under other baseband protocols.

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采用共模反馈控制的减少eme的FlexRay发射机结构

在这篇文章中，FlexRay发射机电路拓扑提出了超过严格的电磁发射（EME）要求在汽车应用。该方法在180nm双极cmos - dmos （BCD）工艺中实现，在输出阶段采用高压器件和共模（CM）反馈机制来有效抑制CM发射，并确保对±40 V干扰的鲁棒性。采用全通检测电路维持回路稳定性，并详细分析了电路参数与回路行为的关系，包括单位增益频率和相位裕度。布局后模拟确认符合FlexRay规范跨工艺角落，电源电压和温度变化。与以前的工作相比，实现了显著的EME减少，特别是在MHz范围内，过量的辐射会干扰附近的节点，即使是在其他基带协议下运行的节点。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

IEEE Transactions on Electromagnetic Compatibility 工程技术-电信学

CiteScore

4.80

自引率

19.00%

发文量

235

审稿时长

2.3 months

期刊介绍： IEEE Transactions on Electromagnetic Compatibility publishes original and significant contributions related to all disciplines of electromagnetic compatibility (EMC) and relevant methods to predict, assess and prevent electromagnetic interference (EMI) and increase device/product immunity. The scope of the publication includes, but is not limited to Electromagnetic Environments; Interference Control; EMC and EMI Modeling; High Power Electromagnetics; EMC Standards, Methods of EMC Measurements; Computational Electromagnetics and Signal and Power Integrity, as applied or directly related to Electromagnetic Compatibility problems; Transmission Lines; Electrostatic Discharge and Lightning Effects; EMC in Wireless and Optical Technologies; EMC in Printed Circuit Board and System Design.