Kinetic Stability and Safety Management Protocols for High-Reactivity Precursors (Zr, Hf, and Si) in Semiconductor Manufacturing: Focusing on Thermal Runaway and Hydrolysis Risks

IF 3.4
Journal of chemical health & safety Pub Date : 2026-05-25 Epub Date: 2026-03-14 DOI:10.1021/acs.chas.5c00219
Tae Hun Kwak, , , Soyoung Ahn, , and , Kyungjun Kang*, 
{"title":"Kinetic Stability and Safety Management Protocols for High-Reactivity Precursors (Zr, Hf, and Si) in Semiconductor Manufacturing: Focusing on Thermal Runaway and Hydrolysis Risks","authors":"Tae Hun Kwak,&nbsp;, ,&nbsp;Soyoung Ahn,&nbsp;, and ,&nbsp;Kyungjun Kang*,&nbsp;","doi":"10.1021/acs.chas.5c00219","DOIUrl":null,"url":null,"abstract":"<p >The transition to sub-10 nm semiconductor nodes necessitates the use of highly reactive zirconium (Zr), hafnium (Hf), and silicon (Si) precursors, which introduce severe safety risks due to their low activation energies and high kinetic lability. This study investigates the critical degradation mechanisms of these precursors, specifically focusing on the self-accelerating thermal decomposition of organometallics and the rapid hydrolysis of chlorosilanes that generates explosive hydrogen gas. By analyzing representative accident scenarios─including canister rupture due to thermal runaway and hydrogen explosions in storage cabinets─we identify significant gaps in current safety guidelines that lack material-specific kinetic data. Consequently, we propose a comprehensive, kinetically based safety management protocol. Key measures include the implementation of a strict active cold chain to prevent thermal runaway, advanced multigas detection systems (H<sub>2</sub>/HCl) for atmosphere control, and a dynamic shelf-life assessment based on thermal history. These strategies provide a scientific framework for mitigating catastrophic risks and ensuring process integrity in next-generation semiconductor fabrication.</p>","PeriodicalId":73648,"journal":{"name":"Journal of chemical health & safety","volume":"33 3","pages":"435–441"},"PeriodicalIF":3.4000,"publicationDate":"2026-05-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://pubs.acs.org/doi/pdf/10.1021/acs.chas.5c00219","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of chemical health & safety","FirstCategoryId":"1085","ListUrlMain":"https://pubs.acs.org/doi/10.1021/acs.chas.5c00219","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"2026/3/14 0:00:00","PubModel":"Epub","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

Abstract

The transition to sub-10 nm semiconductor nodes necessitates the use of highly reactive zirconium (Zr), hafnium (Hf), and silicon (Si) precursors, which introduce severe safety risks due to their low activation energies and high kinetic lability. This study investigates the critical degradation mechanisms of these precursors, specifically focusing on the self-accelerating thermal decomposition of organometallics and the rapid hydrolysis of chlorosilanes that generates explosive hydrogen gas. By analyzing representative accident scenarios─including canister rupture due to thermal runaway and hydrogen explosions in storage cabinets─we identify significant gaps in current safety guidelines that lack material-specific kinetic data. Consequently, we propose a comprehensive, kinetically based safety management protocol. Key measures include the implementation of a strict active cold chain to prevent thermal runaway, advanced multigas detection systems (H2/HCl) for atmosphere control, and a dynamic shelf-life assessment based on thermal history. These strategies provide a scientific framework for mitigating catastrophic risks and ensuring process integrity in next-generation semiconductor fabrication.

半导体制造中高反应性前驱体(Zr, Hf和Si)的动力学稳定性和安全管理协议:关注热失控和水解风险
过渡到10 nm以下的半导体节点需要使用高活性的锆(Zr)、铪(Hf)和硅(Si)前驱体,由于它们的低活化能和高动力学不稳定性,会带来严重的安全风险。本研究探讨了这些前驱体的关键降解机制,特别关注有机金属的自加速热分解和氯硅烷的快速水解,产生爆炸性氢气。通过分析具有代表性的事故场景──包括因热失控导致的气罐破裂和储物柜内的氢气爆炸──我们发现了当前安全指南中缺乏特定材料动力学数据的重大缺陷。因此,我们提出了一个全面的,基于动态的安全管理协议。关键措施包括实施严格的主动冷链以防止热失控,先进的多气体检测系统(H2/HCl)用于大气控制,以及基于热历史的动态货架期评估。这些策略为减轻灾难性风险和确保下一代半导体制造过程的完整性提供了科学框架。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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CiteScore
4.20
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