Biocidal Properties of Composite Material Based on Epoxy Resin Filled with Copper Oxide Nanoparticles

Abstract

In this study, dispersed copper oxide particles were obtained from copper hydroxide in situ in ED‑20 epoxy resin before its thermal polymerization and the effect of their content on changes in the strength properties of polymer composite materials (PCMs) after exposure to destructor microorganisms was determined. PCM samples were prepared with different volume contents of copper oxide particles and tested for resistance to biodestructor micromycetes. The surface morphology of the samples, as well as their mechanical and dielectric properties before and after exposure to microorganisms, were studied. It was shown that a volume concentration of dispersed copper oxide particles of ~0.28% or more is sufficient to effectively suppress the growth of destructors (Aspergillus niger, Penicillus chrysogenum, and Aspergillus puulaauensis) on the surface of the samples, while Young’s modulus and tensile strength are at their maximum. The reduction in tensile strength after exposure to microorganisms did not exceed 10%. The proposed approach to in situ formation of dispersed copper oxide particles allows for a ~1.5-fold increase in the Young’s modulus and tensile strength of PCM samples compared to the samples based on the same epoxy resin but filled with preformed dispersed particles.