3D Printing of Polymer-Derived Graphene/SiCp/SiC Composite by Direct Ink Writing

IF 2.9 4区 材料科学 Q2 CRYSTALLOGRAPHY
Crystals Pub Date : 2024-12-26 DOI:10.3390/cryst15010011
Hongjun Liu, Yajun Li, Run Tang, Yamin Li
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引用次数: 2

Abstract

The direct ink writing (DIW) process has been successfully used to prepare SiC-based composites from preceramic polymers due to the porous light weight, lower sintering temperature, and tailored design. However, it still presents challenges in improving the mechanical properties of composites and endowing them with multifunctionality. In this study, we present a 3D-printing strategy for preparing a graphene/SiCp/SiC composite using the DIW process. A polycarbosilane (PCS)-based slurry containing graphene/SiCp composite powder was developed and 3D-printed into scaffolds with a lattice structure, which were then pyrolyzed at 1500 °C to obtain a graphene/SiCp/SiC composite. The weight loss, viscosity, and printability of the graphene/SiCp/PCS slurry were evaluated, and it was determined that the slurry after 4 h of magnetic stirring was suitable for the DIW process. When heat-treated at above 800 °C in an N2 atmosphere, PCS was first reacted with SiCxOy, which was further transformed into β-SiC and pyrocarbon. The 3D-printed lattice structure achieved porosity and low density, while the SiCp reduced defects caused by large shrinkage during pyrolysis of PCS. Meanwhile, GNPs provided the composites with better conductivity and lower density. The density was as low as 1.08 g/cm3, the conductivity reached 670 S·m−1, and the compressive strength was 4.3 MPa. Thus, a lightweight and porous SiC-based composite with high conductivity and strength can be prepared.
聚合物衍生石墨烯/SiCp/SiC复合材料的直接墨水书写3D打印
由于具有多孔性、重量轻、烧结温度低、定制化设计等优点,直接墨水书写(DIW)工艺已成功地用于从预陶瓷聚合物制备碳化硅基复合材料。然而,在提高复合材料的力学性能和赋予其多功能性方面仍面临挑战。在这项研究中,我们提出了一种3d打印策略,用于使用DIW工艺制备石墨烯/SiCp/SiC复合材料。制备了一种含有石墨烯/SiCp复合粉末的聚碳硅烷(PCS)基浆料,并将其3d打印成具有晶格结构的支架,然后在1500℃下热解得到石墨烯/SiCp/SiC复合材料。通过对石墨烯/SiCp/PCS浆料的失重、粘度和可打印性进行评价,确定经4 h磁搅拌后的浆料适合DIW工艺。在800℃以上的N2气氛中热处理,PCS首先与SiCxOy反应,SiCxOy进一步转化为β-SiC和热解碳。3d打印的晶格结构实现了多孔性和低密度,而SiCp减少了PCS在热解过程中因大收缩而产生的缺陷。同时,GNPs使复合材料具有更好的导电性和更低的密度。密度低至1.08 g/cm3,电导率达670 S·m−1,抗压强度为4.3 MPa。因此,可以制备具有高导电性和高强度的轻质多孔sic基复合材料。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Crystals
Crystals CRYSTALLOGRAPHYMATERIALS SCIENCE, MULTIDIS-MATERIALS SCIENCE, MULTIDISCIPLINARY
CiteScore
4.20
自引率
11.10%
发文量
1527
审稿时长
16.12 days
期刊介绍: Crystals (ISSN 2073-4352) is an open access journal that covers all aspects of crystalline material research. Crystals can act as a reference, and as a publication resource, to the community. It publishes reviews, regular research articles, and short communications. Our aim is to encourage scientists to publish their experimental and theoretical results in as much detail as possible. Therefore, there is no restriction on article length. Full experimental details must be provided to enable the results to be reproduced. Crystals provides a  forum for the advancement of our understanding of the nucleation, growth, processing, and characterization of crystalline materials. Their mechanical, chemical, electronic, magnetic, and optical properties, and their diverse applications, are all considered to be of importance.
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