Adhesion difference between piezoelectric quasicrystals and conventional piezoelectric materials

IF 4.6 2区 工程技术 Q1 ENGINEERING, MECHANICAL
Tao Zheng  (, ), Yueting Zhou  (, ), Qinghui Luo  (, ), Shenghu Ding  (, )
{"title":"Adhesion difference between piezoelectric quasicrystals and conventional piezoelectric materials","authors":"Tao Zheng \n (,&nbsp;),&nbsp;Yueting Zhou \n (,&nbsp;),&nbsp;Qinghui Luo \n (,&nbsp;),&nbsp;Shenghu Ding \n (,&nbsp;)","doi":"10.1007/s10409-025-25695-x","DOIUrl":null,"url":null,"abstract":"<div><p>Unlike conventional piezoelectric materials, quasicrystals (QCs) exhibit piezoelectric properties governed by both phason and phonon fields. As smart parts shrink to the micro-nano scale, surface adhesion becomes significant. To examine the difference of piezoelectric QCs in adhesive behavior compared with conventional piezoelectric materials, this study firstly establishes frictionless Johnson-Kendall-Roberts (JKR) and Maugis-Dugdale (M-D) models for a two-dimensional hexagonal piezoelectric quasicrystal (2D HPQC) half-space indented by a rigid conical indenter (electrically conducting or insulating). Using the superposition principle and Griffith’s energy balance, key adhesive contact parameters are derived analytically. The results of this study are verified by reducing the models to classical piezoelectricity cases reported in the literature. Numerical results demonstrate that adjusting the cone angle and electrical potential influences the adhesive contact behavior of 2D HPQC. Most significantly, the analysis indicates that the adhesive behavior of 2D HPQC shows little difference compared to corresponding results from the conventional piezoelectric framework, as modeled by extended JKR and M-D theories. This work demonstrates that conventional piezoelectric contact theories are sufficient for modeling the adhesion behavior of 2D HPQC for given the specified material coefficients, thereby offering a critical simplification for the design and analysis of QCs-based devices.\n</p><div><figure><div><div><picture><source><img></source></picture><span>The alternative text for this image may have been generated using AI.</span></div></div></figure></div></div>","PeriodicalId":7109,"journal":{"name":"Acta Mechanica Sinica","volume":"42 9","pages":""},"PeriodicalIF":4.6000,"publicationDate":"2026-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Acta Mechanica Sinica","FirstCategoryId":"5","ListUrlMain":"https://link.springer.com/article/10.1007/s10409-025-25695-x","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, MECHANICAL","Score":null,"Total":0}
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Abstract

Unlike conventional piezoelectric materials, quasicrystals (QCs) exhibit piezoelectric properties governed by both phason and phonon fields. As smart parts shrink to the micro-nano scale, surface adhesion becomes significant. To examine the difference of piezoelectric QCs in adhesive behavior compared with conventional piezoelectric materials, this study firstly establishes frictionless Johnson-Kendall-Roberts (JKR) and Maugis-Dugdale (M-D) models for a two-dimensional hexagonal piezoelectric quasicrystal (2D HPQC) half-space indented by a rigid conical indenter (electrically conducting or insulating). Using the superposition principle and Griffith’s energy balance, key adhesive contact parameters are derived analytically. The results of this study are verified by reducing the models to classical piezoelectricity cases reported in the literature. Numerical results demonstrate that adjusting the cone angle and electrical potential influences the adhesive contact behavior of 2D HPQC. Most significantly, the analysis indicates that the adhesive behavior of 2D HPQC shows little difference compared to corresponding results from the conventional piezoelectric framework, as modeled by extended JKR and M-D theories. This work demonstrates that conventional piezoelectric contact theories are sufficient for modeling the adhesion behavior of 2D HPQC for given the specified material coefficients, thereby offering a critical simplification for the design and analysis of QCs-based devices.

The alternative text for this image may have been generated using AI.
压电准晶与传统压电材料的粘附性差异
与传统的压电材料不同,准晶体(qc)表现出由相子和声子场共同控制的压电特性。随着智能部件缩小到微纳米尺度,表面粘附性变得非常重要。为了研究压电准晶体与传统压电材料在粘接性能上的差异,本研究首先建立了二维六边形压电准晶体(2D HPQC)的无摩擦Johnson-Kendall-Roberts (JKR)和Maugis-Dugdale (M-D)模型,用于刚性锥形压头(导电或绝缘)压痕半空间。利用叠加原理和格里菲斯能量平衡,解析导出了胶粘剂的关键接触参数。通过将模型简化为文献中报道的经典压电案例,验证了本研究的结果。数值结果表明,调整锥角和电势对二维HPQC的粘接行为有影响。最重要的是,分析表明,2D HPQC的粘接行为与传统压电框架的相应结果相比,采用扩展的JKR和M-D理论建模的结果差异不大。这项工作表明,传统的压电接触理论足以模拟给定特定材料系数的二维HPQC的粘附行为,从而为基于qcs的器件的设计和分析提供了关键的简化。此图像的替代文本可能是使用AI生成的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Acta Mechanica Sinica
Acta Mechanica Sinica 物理-工程:机械
CiteScore
5.60
自引率
20.00%
发文量
1807
审稿时长
4 months
期刊介绍: Acta Mechanica Sinica, sponsored by the Chinese Society of Theoretical and Applied Mechanics, promotes scientific exchanges and collaboration among Chinese scientists in China and abroad. It features high quality, original papers in all aspects of mechanics and mechanical sciences. Not only does the journal explore the classical subdivisions of theoretical and applied mechanics such as solid and fluid mechanics, it also explores recently emerging areas such as biomechanics and nanomechanics. In addition, the journal investigates analytical, computational, and experimental progresses in all areas of mechanics. Lastly, it encourages research in interdisciplinary subjects, serving as a bridge between mechanics and other branches of engineering and the sciences. In addition to research papers, Acta Mechanica Sinica publishes reviews, notes, experimental techniques, scientific events, and other special topics of interest. Related subjects » Classical Continuum Physics - Computational Intelligence and Complexity - Mechanics
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