Yangyang Guan, Michael Schneider, Dongsheng Li, Hemin Zhang, Jing Mi, Alexander Bertrand, Sina Sadeghpour, Chen Wang, Huicong Liu, Christ Glorieux, Michael Kraft
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引用次数: 0
Abstract
This work describes a hybrid micro-electro-mechanical-systems (MEMS) microphone integrating capacitive and piezoelectric transduction mechanisms for signal-to-noise ratio (SNR) improvement. A theoretical system-level model was established to characterize the hybrid device, which was fabricated using a silicon-on-insulator (SOI) wafer-based process. The piezoelectric transduction component employs a Si/SiO2/Au/AlN/Pt material stack, while the capacitive transduction part consists of a variable capacitor formed by a silicon handle layer and a silicon device layer. Experimental results at 1 kHz show that the hybrid MEMS microphone achieves sensitivities of -64.3 dB (re: 1 V/Pa) in piezoelectric mode, -54.9 dB (re: 1 V/Pa) in capacitive mode, and -52.4 dB (re: 1 V/Pa) in hybrid mode, with corresponding SNR values of 65.7 dB, 59.8 dB, and 62.2 dB, respectively. To enhance the overall SNR of the hybrid MEMS microphone, a signal fusion technique is applied to the dual synchronized signals, resulting in an enhanced SNR of 66.7 dB, exhibiting a 14.1 dB improvement compared to the 52.6 dB reported in previous work.
期刊介绍:
Microsystems & Nanoengineering is a comprehensive online journal that focuses on the field of Micro and Nano Electro Mechanical Systems (MEMS and NEMS). It provides a platform for researchers to share their original research findings and review articles in this area. The journal covers a wide range of topics, from fundamental research to practical applications. Published by Springer Nature, in collaboration with the Aerospace Information Research Institute, Chinese Academy of Sciences, and with the support of the State Key Laboratory of Transducer Technology, it is an esteemed publication in the field. As an open access journal, it offers free access to its content, allowing readers from around the world to benefit from the latest developments in MEMS and NEMS.