A capacitive-piezoelectric hybrid MEMS microphone with signal fusion for enhancing signal-to-noise ratio.

IF 9.9 1区 工程技术 Q1 INSTRUMENTS & INSTRUMENTATION
Yangyang Guan, Michael Schneider, Dongsheng Li, Hemin Zhang, Jing Mi, Alexander Bertrand, Sina Sadeghpour, Chen Wang, Huicong Liu, Christ Glorieux, Michael Kraft
{"title":"A capacitive-piezoelectric hybrid MEMS microphone with signal fusion for enhancing signal-to-noise ratio.","authors":"Yangyang Guan, Michael Schneider, Dongsheng Li, Hemin Zhang, Jing Mi, Alexander Bertrand, Sina Sadeghpour, Chen Wang, Huicong Liu, Christ Glorieux, Michael Kraft","doi":"10.1038/s41378-026-01251-y","DOIUrl":null,"url":null,"abstract":"<p><p>This work describes a hybrid micro-electro-mechanical-systems (MEMS) microphone integrating capacitive and piezoelectric transduction mechanisms for signal-to-noise ratio (SNR) improvement. A theoretical system-level model was established to characterize the hybrid device, which was fabricated using a silicon-on-insulator (SOI) wafer-based process. The piezoelectric transduction component employs a Si/SiO2/Au/AlN/Pt material stack, while the capacitive transduction part consists of a variable capacitor formed by a silicon handle layer and a silicon device layer. Experimental results at 1 kHz show that the hybrid MEMS microphone achieves sensitivities of -64.3 dB (re: 1 V/Pa) in piezoelectric mode, -54.9 dB (re: 1 V/Pa) in capacitive mode, and -52.4 dB (re: 1 V/Pa) in hybrid mode, with corresponding SNR values of 65.7 dB, 59.8 dB, and 62.2 dB, respectively. To enhance the overall SNR of the hybrid MEMS microphone, a signal fusion technique is applied to the dual synchronized signals, resulting in an enhanced SNR of 66.7 dB, exhibiting a 14.1 dB improvement compared to the 52.6 dB reported in previous work.</p>","PeriodicalId":18560,"journal":{"name":"Microsystems & Nanoengineering","volume":"12 1","pages":""},"PeriodicalIF":9.9000,"publicationDate":"2026-04-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.ncbi.nlm.nih.gov/pmc/articles/PMC13084049/pdf/","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microsystems & Nanoengineering","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1038/s41378-026-01251-y","RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"INSTRUMENTS & INSTRUMENTATION","Score":null,"Total":0}
引用次数: 0

Abstract

This work describes a hybrid micro-electro-mechanical-systems (MEMS) microphone integrating capacitive and piezoelectric transduction mechanisms for signal-to-noise ratio (SNR) improvement. A theoretical system-level model was established to characterize the hybrid device, which was fabricated using a silicon-on-insulator (SOI) wafer-based process. The piezoelectric transduction component employs a Si/SiO2/Au/AlN/Pt material stack, while the capacitive transduction part consists of a variable capacitor formed by a silicon handle layer and a silicon device layer. Experimental results at 1 kHz show that the hybrid MEMS microphone achieves sensitivities of -64.3 dB (re: 1 V/Pa) in piezoelectric mode, -54.9 dB (re: 1 V/Pa) in capacitive mode, and -52.4 dB (re: 1 V/Pa) in hybrid mode, with corresponding SNR values of 65.7 dB, 59.8 dB, and 62.2 dB, respectively. To enhance the overall SNR of the hybrid MEMS microphone, a signal fusion technique is applied to the dual synchronized signals, resulting in an enhanced SNR of 66.7 dB, exhibiting a 14.1 dB improvement compared to the 52.6 dB reported in previous work.

一种采用信号融合技术提高信噪比的电容-压电混合MEMS传声器。
这项工作描述了一种集成电容和压电转导机制的混合微机电系统(MEMS)麦克风,用于提高信噪比(SNR)。建立了一个理论系统级模型来表征该混合器件,该器件采用绝缘体上硅(SOI)晶圆工艺制造。压电转导部件采用Si/SiO2/Au/AlN/Pt材料堆叠,电容转导部件由硅手柄层和硅器件层构成的可变电容器组成。实验结果表明,混合MEMS传声器在压电模式下灵敏度为-64.3 dB (re: 1 V/Pa),在电容模式下灵敏度为-54.9 dB (re: 1 V/Pa),在混合模式下灵敏度为-52.4 dB (re: 1 V/Pa),相应的信噪比分别为65.7 dB、59.8 dB和62.2 dB。为了提高混合MEMS麦克风的整体信噪比,对双同步信号采用了信号融合技术,使信噪比提高到66.7 dB,比之前报道的52.6 dB提高了14.1 dB。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
Microsystems & Nanoengineering
Microsystems & Nanoengineering Materials Science-Materials Science (miscellaneous)
CiteScore
12.00
自引率
3.80%
发文量
123
审稿时长
20 weeks
期刊介绍: Microsystems & Nanoengineering is a comprehensive online journal that focuses on the field of Micro and Nano Electro Mechanical Systems (MEMS and NEMS). It provides a platform for researchers to share their original research findings and review articles in this area. The journal covers a wide range of topics, from fundamental research to practical applications. Published by Springer Nature, in collaboration with the Aerospace Information Research Institute, Chinese Academy of Sciences, and with the support of the State Key Laboratory of Transducer Technology, it is an esteemed publication in the field. As an open access journal, it offers free access to its content, allowing readers from around the world to benefit from the latest developments in MEMS and NEMS.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信
小红书