Effects of voltage reduction on changes of shear bond strength and fracture mode of resin-modified glass-ionomer cements after current application.

Abstract

The enhanced bonding performance of dental cements is a clinical challenge, resulting in tooth damage because of excessive adhesion. Consequently, novel smart dental cements capable of on-demand bond strength reduction upon the application of an electrical current (CA) have been developed. Notably, a significant reduction in the shear bond strength (σ_s) of resin-modified glass-ionomer cements (RMGICs) has been reported after the application of a 19 V CA for 30 s. However, this high voltage can damage the soft tissue and dental pulp. Therefore, we investigated whether comparable debonding performance could be achieved at lower voltages. The results showed a significant reduction in σ_s. Importantly, debonding effects equivalent to those obtained with the 19 V condition were achieved at substantially lower voltages of 10-12 V. These findings indicate that reducing the applied voltage can maintain debonding performance while minimizing excessive electrical stimulation during current application.