On-chip stencil lithography for superconducting qubits

Abstract

Improvements in circuit design and, more recently, in materials and surface cleaning have contributed to a rapid development of coherent superconducting qubits. However, organic resists commonly used for shadow evaporation of Josephson junctions (JJs) pose limitations due to residual contamination, poor thermal stability, and compatibility under typical surface-cleaning conditions. To provide an alternative, we developed an inorganic SiO2/Si3N4 on-chip stencil lithography mask for JJ fabrication. The stencil mask is resilient to aggressive cleaning agents and it withstands high temperatures up to 1200 °C, thereby opening new avenues for JJ material exploration and interface optimization. To validate the concept, we performed shadow evaporation of Al-based transmon qubits followed by stencil mask liftoff using vapor hydrofluoric acid, which selectively etches SiO2. We demonstrate an average T1≈75±11 μs over a 200 MHz frequency range across multiple cooldowns for one device, and T1≈44±8 μs for a second device. These results confirm the compatibility of stencil lithography with state-of-the-art superconducting quantum devices and motivate further investigations into materials engineering, film deposition, and surface cleaning techniques.