{"title":"Kinetic Study on the Deoxidation of Blister Copper Using Hydrogen Gas Bubbling","authors":"So-Yeong Lee, Jungshin Kang, Ho-Sang Sohn","doi":"10.1007/s12540-025-02060-0","DOIUrl":null,"url":null,"abstract":"<div><p>This study investigates the deoxidation rate of blister copper (Cu) using hydrogen (H<sub>2</sub>) – argon (Ar) and H<sub>2</sub> gas bubbling. By introducing an H<sub>2</sub> – Ar mixed gas through a submerged lance, the deoxidation reaction occurs at the reaction interface during the rise of gas bubbles. Experiments were conducted at 1473 K, with a total gas flow rate of 0.5 × 10<sup>−5</sup> to 1.5 × 10<sup>−5</sup> m<sup>3</sup>·s<sup>−1</sup> and an initial H<sub>2</sub> partial pressure of 0.2 to 1.0 atm. The deoxidation rate equation of Cu melt was derived based on the two-film model, considering the mass transfer of dissolved oxygen (O) through the liquid boundary layer and the counter-diffusion of H<sub>2</sub> and H<sub>2</sub>O through the gas boundary layer. Additionally, the change in the mass transfer resistances under different reaction conditions was analyzed to investigate the transition of the rate-controlling step. The derived model for the Cu deoxidation rate was validated against the experimental results and showed good agreement. The rate-controlling step successively changed from mass transfer in the gas boundary layer of H<sub>2</sub> to mixed-rate control phase and finally to a mass transfer of O in the liquid boundary layer. Under the conditions used in this study, a lower H<sub>2</sub> partial pressure increased deoxidation efficiency in the latter stage by promoting more complete H<sub>2</sub> consumption within individual bubbles.</p><h3>Graphical Abstract</h3>\n<div><figure><div><div><picture><source><img></source></picture></div></div></figure></div></div>","PeriodicalId":703,"journal":{"name":"Metals and Materials International","volume":"32 5","pages":"1687 - 1699"},"PeriodicalIF":4.5000,"publicationDate":"2025-12-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Metals and Materials International","FirstCategoryId":"88","ListUrlMain":"https://link.springer.com/article/10.1007/s12540-025-02060-0","RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0
Abstract
This study investigates the deoxidation rate of blister copper (Cu) using hydrogen (H2) – argon (Ar) and H2 gas bubbling. By introducing an H2 – Ar mixed gas through a submerged lance, the deoxidation reaction occurs at the reaction interface during the rise of gas bubbles. Experiments were conducted at 1473 K, with a total gas flow rate of 0.5 × 10−5 to 1.5 × 10−5 m3·s−1 and an initial H2 partial pressure of 0.2 to 1.0 atm. The deoxidation rate equation of Cu melt was derived based on the two-film model, considering the mass transfer of dissolved oxygen (O) through the liquid boundary layer and the counter-diffusion of H2 and H2O through the gas boundary layer. Additionally, the change in the mass transfer resistances under different reaction conditions was analyzed to investigate the transition of the rate-controlling step. The derived model for the Cu deoxidation rate was validated against the experimental results and showed good agreement. The rate-controlling step successively changed from mass transfer in the gas boundary layer of H2 to mixed-rate control phase and finally to a mass transfer of O in the liquid boundary layer. Under the conditions used in this study, a lower H2 partial pressure increased deoxidation efficiency in the latter stage by promoting more complete H2 consumption within individual bubbles.
期刊介绍:
Metals and Materials International publishes original papers and occasional critical reviews on all aspects of research and technology in materials engineering: physical metallurgy, materials science, and processing of metals and other materials. Emphasis is placed on those aspects of the science of materials that are concerned with the relationships among the processing, structure and properties (mechanical, chemical, electrical, electrochemical, magnetic and optical) of materials. Aspects of processing include the melting, casting, and fabrication with the thermodynamics, kinetics and modeling.