{"title":"Wall-to-wall adhesion for cellular substrates","authors":"Feng Zhu , Jiawei Zhang , Kaimei Bao , Yinji Ma","doi":"10.1016/j.eml.2026.102461","DOIUrl":null,"url":null,"abstract":"<div><div>The cellular substrates enhance stretchability and allow bio-fluids to pass through the substrates, thus having extensive applications for flexible electronics and bioelectronics. Wall-to-wall adhesion is a common problem encountered during the utilization of the cellular substrates, primarily attributable to the materials’ inherent adhesiveness and low modulus. In this paper, finite element analysis (FEA) is utilized to simulate the wall-to-wall adhesion process of the cellular substrates with the angles from 80<sup>°</sup> to 140 by considering the deformation energy and the adhesion energy. Upon normalization, a scaling law that can determine whether adhesion occurs has been derived. When the normalized work of adhesion is above the critical normalized work of adhesion, adhesion occurs. Otherwise, it does not. Experimental were conducted on the cellular substrates with different angles and materials, and the results agree well with finite element analysis. This study not only reveals the mechanism of adhesion in cellular substrates but also provides practical guidance for the application of cellular substrates in flexible electronics.</div></div>","PeriodicalId":56247,"journal":{"name":"Extreme Mechanics Letters","volume":"83 ","pages":"Article 102461"},"PeriodicalIF":4.5000,"publicationDate":"2026-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Extreme Mechanics Letters","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S2352431626000222","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"2026/2/14 0:00:00","PubModel":"Epub","JCR":"Q2","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0
Abstract
The cellular substrates enhance stretchability and allow bio-fluids to pass through the substrates, thus having extensive applications for flexible electronics and bioelectronics. Wall-to-wall adhesion is a common problem encountered during the utilization of the cellular substrates, primarily attributable to the materials’ inherent adhesiveness and low modulus. In this paper, finite element analysis (FEA) is utilized to simulate the wall-to-wall adhesion process of the cellular substrates with the angles from 80° to 140 by considering the deformation energy and the adhesion energy. Upon normalization, a scaling law that can determine whether adhesion occurs has been derived. When the normalized work of adhesion is above the critical normalized work of adhesion, adhesion occurs. Otherwise, it does not. Experimental were conducted on the cellular substrates with different angles and materials, and the results agree well with finite element analysis. This study not only reveals the mechanism of adhesion in cellular substrates but also provides practical guidance for the application of cellular substrates in flexible electronics.
期刊介绍:
Extreme Mechanics Letters (EML) enables rapid communication of research that highlights the role of mechanics in multi-disciplinary areas across materials science, physics, chemistry, biology, medicine and engineering. Emphasis is on the impact, depth and originality of new concepts, methods and observations at the forefront of applied sciences.