Suppression of mid-spatial-frequency errors in conformal vibration polishing of aspheric optical elements: A review

IF 9.4 Q1 ENGINEERING, MULTIDISCIPLINARY
Results in Engineering Pub Date : 2026-03-01 Epub Date: 2026-02-09 DOI:10.1016/j.rineng.2026.109514
Zhanyang Wang , Ci Song , Bo Wang , Zhaoyang Jiang , Wanli Zhang , Guipeng Tie , Baoqi Gong , Feng Shi , Xing Peng
{"title":"Suppression of mid-spatial-frequency errors in conformal vibration polishing of aspheric optical elements: A review","authors":"Zhanyang Wang ,&nbsp;Ci Song ,&nbsp;Bo Wang ,&nbsp;Zhaoyang Jiang ,&nbsp;Wanli Zhang ,&nbsp;Guipeng Tie ,&nbsp;Baoqi Gong ,&nbsp;Feng Shi ,&nbsp;Xing Peng","doi":"10.1016/j.rineng.2026.109514","DOIUrl":null,"url":null,"abstract":"<div><div>Mid-spatial-frequency (MSF) errors in aspheric optical elements remain a critical bottleneck limiting machining accuracy and functional performance in high-end optical manufacturing. Conventional methods, such as sub-aperture polishing (SAP), rely on path optimization to match surface curvature, yet they impose high demands on machine dynamics, necessitate path simplification, and often require secondary corrections—leading to extended cycles and elevated costs. To overcome these limitations, Conformal Vibration Polishing (CVP) has been developed as a full-aperture-based alternative. By employing high-frequency conformal contact motion between the tool and workpiece, CVP achieves flexible conformal adaptability and real-time adjustment, effectively avoiding path-induced and tool-edge-induced MSF errors. This results in a highly stable and consistent material removal process, enabling efficient and precise convergence of MSF errors. This review systematically examines the development, principles, and material removal characteristics of CVP, with a focus on its mechanism for suppressing MSF errors in aspheric optics. A comparative analysis with SAP highlights the technical advantages and suitable application scenarios of CVP. Finally, future research directions are outlined, positioning CVP as a key technology capable of overcoming the MSF error bottleneck and guiding the future of precision optical surfacing.</div></div>","PeriodicalId":36919,"journal":{"name":"Results in Engineering","volume":"29 ","pages":"Article 109514"},"PeriodicalIF":9.4000,"publicationDate":"2026-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Results in Engineering","FirstCategoryId":"1085","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S2590123026005542","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"2026/2/9 0:00:00","PubModel":"Epub","JCR":"Q1","JCRName":"ENGINEERING, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0

Abstract

Mid-spatial-frequency (MSF) errors in aspheric optical elements remain a critical bottleneck limiting machining accuracy and functional performance in high-end optical manufacturing. Conventional methods, such as sub-aperture polishing (SAP), rely on path optimization to match surface curvature, yet they impose high demands on machine dynamics, necessitate path simplification, and often require secondary corrections—leading to extended cycles and elevated costs. To overcome these limitations, Conformal Vibration Polishing (CVP) has been developed as a full-aperture-based alternative. By employing high-frequency conformal contact motion between the tool and workpiece, CVP achieves flexible conformal adaptability and real-time adjustment, effectively avoiding path-induced and tool-edge-induced MSF errors. This results in a highly stable and consistent material removal process, enabling efficient and precise convergence of MSF errors. This review systematically examines the development, principles, and material removal characteristics of CVP, with a focus on its mechanism for suppressing MSF errors in aspheric optics. A comparative analysis with SAP highlights the technical advantages and suitable application scenarios of CVP. Finally, future research directions are outlined, positioning CVP as a key technology capable of overcoming the MSF error bottleneck and guiding the future of precision optical surfacing.
非球面光学元件共形振动抛光中频误差的抑制研究进展
在高端光学制造中,非球面光学元件的中空频误差一直是制约加工精度和功能性能的关键瓶颈。传统的方法,如子孔径抛光(SAP),依赖于路径优化来匹配表面曲率,但它们对机器动力学提出了很高的要求,需要简化路径,并且经常需要二次修正,从而导致周期延长和成本增加。为了克服这些限制,共形振动抛光(CVP)已经发展成为一种基于全孔径的替代方案。CVP利用刀具与工件之间的高频共形接触运动,实现了灵活的共形自适应和实时调整,有效避免了由路径和刀具边缘引起的MSF误差。这导致了高度稳定和一致的材料去除过程,实现了MSF误差的有效和精确收敛。本文系统地综述了CVP的发展、原理和材料去除特性,重点讨论了其抑制非球面光学中MSF误差的机理。通过与SAP的对比分析,突出了CVP的技术优势和适合的应用场景。最后,展望了未来的研究方向,将CVP定位为能够克服MSF误差瓶颈的关键技术,并指导未来的精密光学表面加工。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Results in Engineering
Results in Engineering Engineering-Engineering (all)
CiteScore
5.80
自引率
34.00%
发文量
441
审稿时长
47 days
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