Experimental study on grinding silicon wafer by resin-bonded agglomerated diamond grinding wheel

Abstract

Diamond agglomerated abrasives are used in fixed abrasive applications to enhance the performance and longevity of grinding media. In this study, the diamond agglomerated abrasives with three different particle sizes(the particle sizes D50 of 25.5 μm, 32.0 μm, and 38.8 μm) were prepared by centrifugal drying granulation method, which were referred to as A‒, B‒, and C‒ agglomerated abrasives, respectively. These agglomerated abrasives were then used to make resin bond grinding wheels, and grinding tests were carried out on a DISCO DFG8540 grinding machine. The particle size and strength of agglomerated abrasives, the surface analysis of grinding wheel before and after grinding, wear resistance of grinding wheel, grinding current, and surface roughness of workpiece were analyzed against the grinding of silicon wafers. Results reveal that the particle size distribution of agglomerated abrasive particles prepared by spray granulation process is A ≈ B > C, and their static pressure strength is A > B > C. The grinding tests results show that the spindle current for grinding wheels prepared by A and B agglomerated abrasives increases rapidly, with the overall current value higher than that of the C agglomerated abrasives. However, the wear ratio of grinding wheels made from A and B agglomerated abrasives is very low during grinding, resulting in poor grinding quality of the workpiece. In contrast, the grinding wheels made from C agglomerated abrasives wear steadily, ensuring overall self-sharpening of the grinding wheels and high consistency in grinding quality, though with the highest surface roughness.