S. Varsha Antanitta, Payal Varma, Balasubramanian Kandasubramanian
{"title":"Next-Generation Chitosan packaging incorporating turmeric oil and Tetracycline for extended shelf life and microbial resistance","authors":"S. Varsha Antanitta, Payal Varma, Balasubramanian Kandasubramanian","doi":"10.1007/s13197-026-06610-1","DOIUrl":null,"url":null,"abstract":"<div><p>Growing environmental concerns over conventional plastic packaging have sparked increased interest in biodegradable alternatives that offer active functional properties. In this study, a chitosan-based packaging film was developed using the solvent casting method and functionalized with turmeric oil and tetracycline hydrochloride to enhance its antimicrobial performance. The film was evaluated for antibacterial and antifungal activity using the agar well diffusion method, showing inhibition zones of 3.1 cm against <i>Escherichia coli</i>, 3.0 cm against <i>S aureus</i>, and 1.2 cm against <i>Aspergillus niger</i> for the 10 wt% tetracycline formulation. In vitro drug release studies indicated a controlled release profile, with turmeric oil achieving up to 26% cumulative release and tetracycline up to 5.8%. The film exhibited improved mechanical strength (tensile strength up to 68 MPa), low water vapor permeability (2.26 × 10<sup>−8</sup> g·m/Pa·s·m<sup>2</sup>), and high biodegradability (88.4% weight loss in 35 days). These findings highlight its promise as an eco-friendly, antimicrobial packaging material.</p></div>","PeriodicalId":632,"journal":{"name":"Journal of Food Science and Technology","volume":"63 3","pages":"595 - 600"},"PeriodicalIF":2.7010,"publicationDate":"2026-02-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Food Science and Technology","FirstCategoryId":"1","ListUrlMain":"https://link.springer.com/article/10.1007/s13197-026-06610-1","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Growing environmental concerns over conventional plastic packaging have sparked increased interest in biodegradable alternatives that offer active functional properties. In this study, a chitosan-based packaging film was developed using the solvent casting method and functionalized with turmeric oil and tetracycline hydrochloride to enhance its antimicrobial performance. The film was evaluated for antibacterial and antifungal activity using the agar well diffusion method, showing inhibition zones of 3.1 cm against Escherichia coli, 3.0 cm against S aureus, and 1.2 cm against Aspergillus niger for the 10 wt% tetracycline formulation. In vitro drug release studies indicated a controlled release profile, with turmeric oil achieving up to 26% cumulative release and tetracycline up to 5.8%. The film exhibited improved mechanical strength (tensile strength up to 68 MPa), low water vapor permeability (2.26 × 10−8 g·m/Pa·s·m2), and high biodegradability (88.4% weight loss in 35 days). These findings highlight its promise as an eco-friendly, antimicrobial packaging material.
期刊介绍:
The Journal of Food Science and Technology (JFST) is the official publication of the Association of Food Scientists and Technologists of India (AFSTI). This monthly publishes peer-reviewed research papers and reviews in all branches of science, technology, packaging and engineering of foods and food products. Special emphasis is given to fundamental and applied research findings that have potential for enhancing product quality, extend shelf life of fresh and processed food products and improve process efficiency. Critical reviews on new perspectives in food handling and processing, innovative and emerging technologies and trends and future research in food products and food industry byproducts are also welcome. The journal also publishes book reviews relevant to all aspects of food science, technology and engineering.