A novel powder metallurgy strategy for fabricating copper foam sandwiches with metallurgical bonding interfaces

IF 4.9 3区 材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY
He Yanping, Jian Xiao, Gong Jiahao, Guibao Qiu
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引用次数: 0

Abstract

This study introduces a powder metallurgy-based strategy to fabricate copper foam sandwiches (CFSs) with metallurgical bonding interfaces, thereby overcoming the interfacial limitations of conventional riveted or brazed CFSs. A panel-core-panel structure was constructed using copper powder and needle-shaped carbamide, followed by pressing and gradient sintering, which simultaneously enabled porous core formation and interfacial bonding. SEM-EDS, XRD and μ -CT analyses confirmed continuous Cu distribution across the CFS interface via atomic diffusion. Mechanical testing showed that the CFS exhibited a compressive strength of 24.8 MPa (comparable to that of single-layer copper foam, 25.2 MPa) and a shear strength of 43.2 MPa, which was approximately ten times higher than that of single-layer copper foam (4.1 MPa) and over thirteen times greater than that of brazed CFS (3.2 MPa). This improvement results from reduced interfacial resistance due to metallurgical bonding. The proposed strategy achieves structural-mechanical synergy and offers a scalable solution for developing high-strength metal foam sandwich structures.
一种新型粉末冶金方法制备具有冶金结合界面的泡沫铜夹层
本研究介绍了一种基于粉末冶金的策略来制造具有冶金结合界面的泡沫铜夹层(cfs),从而克服了传统铆接或钎焊cfs的界面限制。利用铜粉和针状尿素构建了板-芯-板结构,然后进行压制和梯度烧结,同时实现了多孔芯的形成和界面结合。SEM-EDS、XRD和μ -CT分析证实Cu通过原子扩散在CFS界面上连续分布。力学试验表明,CFS的抗压强度为24.8 MPa(与单层泡沫铜的25.2 MPa相当),抗剪强度为43.2 MPa,比单层泡沫铜的4.1 MPa高约10倍,比钎焊CFS的3.2 MPa高13倍以上。这种改进是由于冶金结合减少了界面阻力。该策略实现了结构-力学协同作用,为开发高强度金属泡沫夹层结构提供了可扩展的解决方案。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Materials Today Communications
Materials Today Communications Materials Science-General Materials Science
CiteScore
5.20
自引率
5.30%
发文量
1783
审稿时长
51 days
期刊介绍: Materials Today Communications is a primary research journal covering all areas of materials science. The journal offers the materials community an innovative, efficient and flexible route for the publication of original research which has not found the right home on first submission.
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