Coplanarity Index for Potential Slip Systems Predicting in Plastic Semiconductors

IF 24.5 Q1 CHEMISTRY, PHYSICAL
Xingyan Dong, Yongqiang Yan, Zihang Liu, Yu-Ke Zhu, Jianbo Zhu, Lankun Wang, Jinsuo Hu, Kuai Yu, Muchun Guo, Ming Liu, Fengkai Guo, Ge Wu, Wei Cai, Zhi-Wei Shan, Jiehe Sui
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Abstract

Despite growing interest in room-temperature plastic semiconductors, understanding and predicting slip modes in semiconductors remains a fundamental challenge due to their complex, low-symmetry structures. Applying analytical frameworks of metal plasticity to semiconductors directly can lead to the ignorance of the quasi-coplanarity in semiconductors due to their complex structures. In this work, we introduce a geometric-descriptor guided strategy to identify potential operative slip systems in semiconductors. A coplanarity index (CI) is developed to quantitatively characterize the quasi-aligned nature of atomic planes. The applicability of the CI is demonstrated in high-performance plastic thermoelectric material Mg3Sb2. A quasi-aligned pyramidal plane { 0 1 ¯ 11 } with high CI value in hexagonal Mg3Sb2 is predicted to be the active slip plane for 〈c + a〉 dislocation slip, accommodating plastic deformation along the c-axis, which is a mechanism that has not been previously recognized in hexagonal semiconductors. The CI values of the { 0 1 ¯ 11 } planes also reflect the differences in the atom configurations among the isostructure AB2X2 Zintl phases, which indicates the good plasticity of Mg3Sb2 from the perspective of coplanarity. This geometry-energy integrated framework offers a quantitative methodology for understanding and designing ductile functional semiconductors.

Abstract Image

塑料半导体中潜在滑移系统预测的共平面指数
尽管人们对室温塑料半导体的兴趣日益浓厚,但由于半导体结构复杂、不对称,理解和预测半导体的滑移模式仍然是一个基本挑战。将金属塑性分析框架直接应用于半导体,由于半导体结构复杂,容易忽略其准共平面性。在这项工作中,我们引入了一种几何描述符引导策略来识别半导体中潜在的操作滑移系统。提出了共平面指数(CI)来定量表征原子平面的准对准性质。在高性能塑料热电材料Mg3Sb2中证明了CI的适用性。准对齐锥体平面{0.1¯11六角形Mg3Sb2中具有高CI值的}是< c + a >位错滑移的活动滑移面,可容纳沿c轴的塑性变形,这是以前在六角形半导体中未发现的机制。{0 1¯11}平面还反映了AB2X2 Zintl相中原子构型的差异,从共平面角度说明Mg3Sb2具有良好的塑性。这种几何能量集成框架为理解和设计延性功能半导体提供了一种定量方法。
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