A piezoelectric hybrid-driven manufacturing system for processing micro indentation arrays to regulate the optical reflection characteristics of metal surfaces

IF 4.9 3区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

Sensors and Actuators A-physical Pub Date : 2026-05-01 Epub Date: 2026-02-14 DOI:10.1016/j.sna.2026.117599

Xin Yang, Zaizhen Lou, Bosen Jia, Yongda Yan, Yanquan Geng

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引用次数: 0

Abstract

Nanoindentation-based manufacturing has been widely used for the fabrication of complex microstructural arrays, but its application has been constrained by limited processing ranges and unstable indentation depths. In this study, we develop a nanoindentation-based piezoelectric manufacturing system (PMS) to overcome these limitations. The PMS combines a piezoelectric driven two-dimensional micro-positioning stage (2D-MPS) with an indentation manufacturing module (IMM) to achieve a processing range of 30 mm × 30 mm and a maximum indentation depth of 9.25 μm for manufacturing micro indentation arrays. The 2D-MPS integrates laser displacement feedback for large-area, high-precision positioning. The processing strategy of force control takes the normal force of the indentation process as feedback, ensuring that the depth of multiple indentations is uniform over a large range, achieving the manufacturing of transverse (macroscopic to microscopic) planar micro indentation. The machining performance of the PMS under displacement-feedback and force-control modes was systematically characterized. Experimental results show that the system attains a positioning error below 2 % and a depth deviation of less than 200 nm. Furthermore, a pyramid-shaped micro-indentation array with an area of 2 mm × 2 mm was successfully fabricated on an aluminum alloy surface, and its ability to modulate optical reflection characteristics was experimentally verified. These results demonstrate that the proposed PMS provides a promising approach for the fabrication of planar micro-indentation structures with large depths and wide processing areas.

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一种用于加工微压痕阵列以调节金属表面光学反射特性的压电混合驱动制造系统

纳米压痕技术已广泛应用于复杂微结构阵列的制造，但其应用受到加工范围有限和压痕深度不稳定的限制。在这项研究中，我们开发了一种基于纳米压痕的压电制造系统（PMS）来克服这些限制。PMS结合了压电驱动的二维微定位平台（2D-MPS）和压痕制造模块（IMM），可实现30 mm × 30 mm的加工范围和9.25 μm的最大压痕深度，用于制造微压痕阵列。2D-MPS集成了激光位移反馈，用于大面积、高精度定位。力控制的加工策略以压痕过程的法向力为反馈，保证多个压痕深度在大范围内均匀，实现横向（宏观到微观）平面微压痕的制造。系统地描述了位移反馈和力控制两种模式下永磁同步系统的加工性能。实验结果表明，该系统的定位误差小于2 %，深度偏差小于200 nm。此外，在铝合金表面成功制备了面积为2 mm × 2 mm的金字塔型微压孔阵列，并通过实验验证了其对光反射特性的调制能力。这些结果表明，所提出的PMS为制造具有大深度和宽加工区域的平面微压痕结构提供了一种有前途的方法。

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来源期刊

Sensors and Actuators A-physical 工程技术-工程：电子与电气

CiteScore

8.10

自引率

6.50%

发文量

630

审稿时长

49 days

期刊介绍： Sensors and Actuators A: Physical brings together multidisciplinary interests in one journal entirely devoted to disseminating information on all aspects of research and development of solid-state devices for transducing physical signals. Sensors and Actuators A: Physical regularly publishes original papers, letters to the Editors and from time to time invited review articles within the following device areas: • Fundamentals and Physics, such as: classification of effects, physical effects, measurement theory, modelling of sensors, measurement standards, measurement errors, units and constants, time and frequency measurement. Modeling papers should bring new modeling techniques to the field and be supported by experimental results. • Materials and their Processing, such as: piezoelectric materials, polymers, metal oxides, III-V and II-VI semiconductors, thick and thin films, optical glass fibres, amorphous, polycrystalline and monocrystalline silicon. • Optoelectronic sensors, such as: photovoltaic diodes, photoconductors, photodiodes, phototransistors, positron-sensitive photodetectors, optoisolators, photodiode arrays, charge-coupled devices, light-emitting diodes, injection lasers and liquid-crystal displays. • Mechanical sensors, such as: metallic, thin-film and semiconductor strain gauges, diffused silicon pressure sensors, silicon accelerometers, solid-state displacement transducers, piezo junction devices, piezoelectric field-effect transducers (PiFETs), tunnel-diode strain sensors, surface acoustic wave devices, silicon micromechanical switches, solid-state flow meters and electronic flow controllers. Etc...