Hongxin Deng , Guilian Wang , Chunyan Zhao , Dongdong Xie
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引用次数: 0
Abstract
The hydrothermal performance of the microchannel heat sink with novel aircraft-shaped varied-section ribs (AVSRs) is numerically investigated in the present paper. The AVSR has two distinctive structural features: a streamlined bulge surface and a curved back end. The streamlined bulge surface can induce a remarkable impingement effect in the microchannel, and the curved back end promotes the formation of recirculation in both vertical and horizontal directions. These combine to promote significant convective heat transfer, which improves the cooling efficiency of the heat sink. The AVSR is compared with two rectangular ribs: one has the same length and height as the AVSR (LHR), and the other possesses the same volume (VOR). The microchannel with AVSRs (MC-AVSR) presents an increment of 10.56–61.20 % in Nusselt number (Nu) compared to the smooth microchannel (MC-SC). Meanwhile, the MC-AVSR reveals the implementation of 4.30–45.01 % and 5.39–24.58 % in Nu compared with the microchannel with LHRs (MC-LHR) and VORs (MC-VOR), respectively. Moreover, the apparent friction factor of MC-AVSR is reduced by 1.72–13.92 % and 2.10–3.95 % in comparison with those of MC-LHR and MC-VOR, respectively. These demonstrate that the AVSRs more effectively enhance the thermal performance and also produce less blockage to fluid flow. Moreover, the thermal enhancement factor of MC-AVSR remains larger than 1, indicating that the promoted heat transfer effectiveness consistently offsets the pressure drop penalty induced by the AVSRs.
期刊介绍:
The International Journal of Heat and Fluid Flow welcomes high-quality original contributions on experimental, computational, and physical aspects of convective heat transfer and fluid dynamics relevant to engineering or the environment, including multiphase and microscale flows.
Papers reporting the application of these disciplines to design and development, with emphasis on new technological fields, are also welcomed. Some of these new fields include microscale electronic and mechanical systems; medical and biological systems; and thermal and flow control in both the internal and external environment.