The flow and heat transfer performance of a novel double-spiral heat sink for processing unit cooling

IF 4.8 3区 工程技术 Q2 ENGINEERING, MECHANICAL
Feiyu Chen , Chenghao Liu , Xin Wu , Shida Yao , Wenguang Liu , Wei Chang
{"title":"The flow and heat transfer performance of a novel double-spiral heat sink for processing unit cooling","authors":"Feiyu Chen ,&nbsp;Chenghao Liu ,&nbsp;Xin Wu ,&nbsp;Shida Yao ,&nbsp;Wenguang Liu ,&nbsp;Wei Chang","doi":"10.1016/j.ijheatfluidflow.2026.110299","DOIUrl":null,"url":null,"abstract":"<div><div>The escalating thermal power of processors demands advanced cooling solutions. This study proposes a novel double-spiral heat sink (DSHS) with dual inlets and outlets to address this challenge. First, experiments were conducted to test the performance of different inlet methods. When cooling water flows in from the end with a larger radius of curvature, the temperature difference of the CPU can be 49.3% lower than other methods. A decrease in the radius of curvature enhances the disturbance of the fluid, mitigating the negative impact of rising water temperature on the temperature difference. The simulation results show good consistency with the experimental data. The optimal spiral dimensions are determined to be <em>r</em> = 3 mm and <em>R</em> = 15 mm based on the geometric parameter analysis. Compared with single spiral heat sink (SSHS), DSHS can reduce the pressure drop by 48.3% and temperature difference by 64.1%. In addition, the DSHS is compared with the serpentine heat sink (SHS) to prove its advantages. The results show that the average temperature of the DSHS is slightly lower than that of the SHS, while the pressure drop, temperature difference, and performance evaluation criterion are all significantly better than those of the SHS. DSHS can dissipate a maximum heat of 438 W. The varying radius of curvature of DSHS can continuously disrupt the boundary layer and enhance heat transfer. Furthermore, by slotting the wall surface, the pressure drop is reduced by 10% without affecting the heat dissipation. The DSHS maintains its performance benefits across different working fluids such as ethylene glycol solution and transformer oil, showing its advantage of wide applicability. The proposed DSHS provides a promising alternative design of heat sinks for the processing unit cooling applications.</div></div>","PeriodicalId":335,"journal":{"name":"International Journal of Heat and Fluid Flow","volume":"119 ","pages":"Article 110299"},"PeriodicalIF":4.8000,"publicationDate":"2026-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Journal of Heat and Fluid Flow","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0142727X26000652","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"2026/2/6 0:00:00","PubModel":"Epub","JCR":"Q2","JCRName":"ENGINEERING, MECHANICAL","Score":null,"Total":0}
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Abstract

The escalating thermal power of processors demands advanced cooling solutions. This study proposes a novel double-spiral heat sink (DSHS) with dual inlets and outlets to address this challenge. First, experiments were conducted to test the performance of different inlet methods. When cooling water flows in from the end with a larger radius of curvature, the temperature difference of the CPU can be 49.3% lower than other methods. A decrease in the radius of curvature enhances the disturbance of the fluid, mitigating the negative impact of rising water temperature on the temperature difference. The simulation results show good consistency with the experimental data. The optimal spiral dimensions are determined to be r = 3 mm and R = 15 mm based on the geometric parameter analysis. Compared with single spiral heat sink (SSHS), DSHS can reduce the pressure drop by 48.3% and temperature difference by 64.1%. In addition, the DSHS is compared with the serpentine heat sink (SHS) to prove its advantages. The results show that the average temperature of the DSHS is slightly lower than that of the SHS, while the pressure drop, temperature difference, and performance evaluation criterion are all significantly better than those of the SHS. DSHS can dissipate a maximum heat of 438 W. The varying radius of curvature of DSHS can continuously disrupt the boundary layer and enhance heat transfer. Furthermore, by slotting the wall surface, the pressure drop is reduced by 10% without affecting the heat dissipation. The DSHS maintains its performance benefits across different working fluids such as ethylene glycol solution and transformer oil, showing its advantage of wide applicability. The proposed DSHS provides a promising alternative design of heat sinks for the processing unit cooling applications.
一种新型双螺旋散热器的流动和传热性能
处理器不断升级的热功率需要先进的冷却解决方案。为了解决这一问题,本研究提出了一种具有双入口和双出口的新型双螺旋散热器(DSHS)。首先,通过实验对不同进气道的性能进行了测试。当冷却水从曲率半径较大的一端流入时,CPU的温度差可比其他方式降低49.3%。曲率半径的减小增强了流体的扰动,减轻了水温升高对温差的负面影响。仿真结果与实验数据吻合较好。通过几何参数分析,确定了最佳螺旋尺寸r = 3mm和r = 15mm。与单螺旋散热器(SSHS)相比,DSHS可将压降降低48.3%,温差降低64.1%。此外,还将DSHS与蛇形散热器(SHS)进行了比较,证明了其优点。结果表明:DSHS的平均温度略低于SHS,而压降、温差、性能评价指标均明显优于SHS。DSHS的最大散热功率为438w。DSHS曲率半径的变化可以不断破坏边界层,增强传热。此外,通过开槽壁面,在不影响散热的情况下,压降降低了10%。DSHS在不同的工作流体(如乙二醇溶液和变压器油)中保持其性能优势,显示出其广泛适用性的优势。所提出的DSHS为处理装置的冷却应用提供了一种有前途的散热器替代设计。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
International Journal of Heat and Fluid Flow
International Journal of Heat and Fluid Flow 工程技术-工程:机械
CiteScore
5.00
自引率
7.70%
发文量
131
审稿时长
33 days
期刊介绍: The International Journal of Heat and Fluid Flow welcomes high-quality original contributions on experimental, computational, and physical aspects of convective heat transfer and fluid dynamics relevant to engineering or the environment, including multiphase and microscale flows. Papers reporting the application of these disciplines to design and development, with emphasis on new technological fields, are also welcomed. Some of these new fields include microscale electronic and mechanical systems; medical and biological systems; and thermal and flow control in both the internal and external environment.
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