CHIPSIM: A Co-Simulation Framework for Deep Learning on Chiplet-Based Systems

IF 3.7
Lukas Pfromm;Alish Kanani;Harsh Sharma;Janardhan Rao Doppa;Partha Pratim Pande;Umit Y. Ogras
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Abstract

Due to reduced manufacturing yields, traditional monolithic chips cannot keep up with the compute, memory, and communication demands of data-intensive applications, such as rapidly growing deep neural network (DNN) models. Chiplet-based architectures offer a cost-effective and scalable solution by integrating smaller chiplets via a network-on-interposer (NoI). Fast and accurate simulation approaches are critical to unlocking this potential, but existing methods lack the required accuracy, speed, and flexibility. To address this need, this work presents CHIPSIM, a comprehensive co-simulation framework designed for parallel DNN execution on chiplet-based systems. CHIPSIM concurrently models computation and communication, accurately capturing network contention and pipelining effects that conventional simulators overlook. Furthermore, it profiles the chiplet and NoI power consumptions at microsecond granularity for precise transient thermal analysis. Extensive evaluations with homogeneous/heterogeneous chiplets and different NoI architectures demonstrate the framework’s versatility, up to 340% accuracy improvement, and power/thermal analysis capability.
CHIPSIM:基于芯片系统的深度学习联合仿真框架
由于制造产量降低,传统的单片芯片无法满足数据密集型应用的计算、内存和通信需求,例如快速增长的深度神经网络(DNN)模型。基于芯片的架构通过中间层网络(NoI)集成更小的芯片,提供了一种经济高效且可扩展的解决方案。快速准确的模拟方法对于释放这一潜力至关重要,但现有方法缺乏所需的准确性、速度和灵活性。为了满足这一需求,这项工作提出了CHIPSIM,这是一个全面的联合仿真框架,旨在在基于芯片的系统上并行执行DNN。CHIPSIM同时模拟计算和通信,准确捕捉网络竞争和流水线效应,传统的模拟器忽略。此外,它描述了微秒粒度的芯片和NoI功耗,用于精确的瞬态热分析。对同质/异质芯片和不同NoI架构的广泛评估证明了该框架的多功能性,高达340%的精度提高,以及功率/热分析能力。
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