{"title":"Hybrid FEA-ML Optimization of Passive Low-Frequency Shields With Eccentric Conductors","authors":"Tianchu Li, Yuanhuang Liu, Ning Wei, Wuqi Han","doi":"10.1049/ell2.70521","DOIUrl":null,"url":null,"abstract":"<p>This work proposes an eccentric conductor plate design aimed at overcoming the pervasive issue of diminished shielding effectiveness (SE) at the boundaries of traditional plates, thereby enabling wider and more efficient low-frequency electromagnetic shielding. Compared to traditional flat and other shaped plates, the wave-type configuration demonstrates superior SE and effective shielding area, compared to traditional plat type, achieving a maximum increase of 12.36% in SE at the point of maximum magnetic field intensity and 94.42% in effective shielding coverage. Utilizing 1600 finite element analysis (FEA) simulations, a Deep Belief Networks—backpropagation model was developed to capture multi‑parameter relationships. This led to the establishment of a multi‑objective geometric optimization procedure based on central SE, SE at the point of maximum field strength, and effective shielding area, thereby laying a foundation for practical engineering applications.</p>","PeriodicalId":11556,"journal":{"name":"Electronics Letters","volume":"62 1","pages":""},"PeriodicalIF":1.0000,"publicationDate":"2026-01-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ietresearch.onlinelibrary.wiley.com/doi/epdf/10.1049/ell2.70521","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electronics Letters","FirstCategoryId":"5","ListUrlMain":"https://onlinelibrary.wiley.com/doi/10.1049/ell2.70521","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
This work proposes an eccentric conductor plate design aimed at overcoming the pervasive issue of diminished shielding effectiveness (SE) at the boundaries of traditional plates, thereby enabling wider and more efficient low-frequency electromagnetic shielding. Compared to traditional flat and other shaped plates, the wave-type configuration demonstrates superior SE and effective shielding area, compared to traditional plat type, achieving a maximum increase of 12.36% in SE at the point of maximum magnetic field intensity and 94.42% in effective shielding coverage. Utilizing 1600 finite element analysis (FEA) simulations, a Deep Belief Networks—backpropagation model was developed to capture multi‑parameter relationships. This led to the establishment of a multi‑objective geometric optimization procedure based on central SE, SE at the point of maximum field strength, and effective shielding area, thereby laying a foundation for practical engineering applications.
期刊介绍:
Electronics Letters is an internationally renowned peer-reviewed rapid-communication journal that publishes short original research papers every two weeks. Its broad and interdisciplinary scope covers the latest developments in all electronic engineering related fields including communication, biomedical, optical and device technologies. Electronics Letters also provides further insight into some of the latest developments through special features and interviews.
Scope
As a journal at the forefront of its field, Electronics Letters publishes papers covering all themes of electronic and electrical engineering. The major themes of the journal are listed below.
Antennas and Propagation
Biomedical and Bioinspired Technologies, Signal Processing and Applications
Control Engineering
Electromagnetism: Theory, Materials and Devices
Electronic Circuits and Systems
Image, Video and Vision Processing and Applications
Information, Computing and Communications
Instrumentation and Measurement
Microwave Technology
Optical Communications
Photonics and Opto-Electronics
Power Electronics, Energy and Sustainability
Radar, Sonar and Navigation
Semiconductor Technology
Signal Processing
MIMO