Chiplets Interface Protocol (ChIP) for Ultra-Large-Scale Applications

IF 3.8 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Arvin Delavari;Boris Vaisband
{"title":"Chiplets Interface Protocol (ChIP) for Ultra-Large-Scale Applications","authors":"Arvin Delavari;Boris Vaisband","doi":"10.1109/JETCAS.2025.3591559","DOIUrl":null,"url":null,"abstract":"As computational workloads continue to grow, heterogeneous integration of chiplet-based systems is becoming critically important for data-intensive applications such as high-performance computing, large language models, and artificial intelligence. Scaling to ultra-large-scale (ULS) systems introduces, however, significant communication challenges due to the limitations of network architectures and packaging technologies. Efficient data transfer across a network of thousands of chiplets remains a critical bottleneck. A robust, low-latency, area- and energy-efficient communication architecture for ULS system named Chiplet Interface Protocol (ChIP) is proposed in this work. ChIP supports burst transfers and out-of-order transactions while leveraging the simple universal parallel interface for chips (SuperCHIPS)—a simple area- and energy-efficient streaming channel at the physical layer. Evaluated on a wafer-scale platform, ChIP was compared to state-of-the-art (SOTA) chiplet-based interfaces, including LIPINCON, BoW, UCIe, and AIB, in performance, hardware efficiency, and unified signaling figures of merit. From the comparison results, ChIP significantly outperforms the SOTA alternatives (<inline-formula> <tex-math>$5.53\\times $ </tex-math></inline-formula> better) in bandwidth per shoreline, reaching 2.2 Tbps/mm in pipelined mode and up to 7.3 Tbps/mm in burst transactions. In addition, the transceiver area per link in ChIP is <inline-formula> <tex-math>$485~\\mu $ </tex-math></inline-formula>m<sup>2</sup>—46.1% smaller than the best SOTA alternative—while achieving 0.38–0.53 pJ/bit energy and 1 ns latency in 45 nm CMOS over a 0.5 mm link, with efficiency sustained across longer channels and varied packaging due to minimal handshaking and optimized point-to-point specifications. The performance of ChIP is evaluated across multiple network configurations on a fine-pitch integration platform, and also for a customized hybrid topology, referred to as the network on interconnect fabric (NoIF), that is introduced and analyzed in this work. The architecture of the NoIF forms the foundation for ULS computing platforms, delivering exceptional results as compared to SOTA solutions. The superior hardware efficiency and advanced inter-chiplet communication features of ChIP position this proposed protocol as an ideal candidate for chiplet communication in ULS architectures.","PeriodicalId":48827,"journal":{"name":"IEEE Journal on Emerging and Selected Topics in Circuits and Systems","volume":"15 4","pages":"585-598"},"PeriodicalIF":3.8000,"publicationDate":"2025-07-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11088081","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Journal on Emerging and Selected Topics in Circuits and Systems","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/11088081/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0

Abstract

As computational workloads continue to grow, heterogeneous integration of chiplet-based systems is becoming critically important for data-intensive applications such as high-performance computing, large language models, and artificial intelligence. Scaling to ultra-large-scale (ULS) systems introduces, however, significant communication challenges due to the limitations of network architectures and packaging technologies. Efficient data transfer across a network of thousands of chiplets remains a critical bottleneck. A robust, low-latency, area- and energy-efficient communication architecture for ULS system named Chiplet Interface Protocol (ChIP) is proposed in this work. ChIP supports burst transfers and out-of-order transactions while leveraging the simple universal parallel interface for chips (SuperCHIPS)—a simple area- and energy-efficient streaming channel at the physical layer. Evaluated on a wafer-scale platform, ChIP was compared to state-of-the-art (SOTA) chiplet-based interfaces, including LIPINCON, BoW, UCIe, and AIB, in performance, hardware efficiency, and unified signaling figures of merit. From the comparison results, ChIP significantly outperforms the SOTA alternatives ( $5.53\times $ better) in bandwidth per shoreline, reaching 2.2 Tbps/mm in pipelined mode and up to 7.3 Tbps/mm in burst transactions. In addition, the transceiver area per link in ChIP is $485~\mu $ m2—46.1% smaller than the best SOTA alternative—while achieving 0.38–0.53 pJ/bit energy and 1 ns latency in 45 nm CMOS over a 0.5 mm link, with efficiency sustained across longer channels and varied packaging due to minimal handshaking and optimized point-to-point specifications. The performance of ChIP is evaluated across multiple network configurations on a fine-pitch integration platform, and also for a customized hybrid topology, referred to as the network on interconnect fabric (NoIF), that is introduced and analyzed in this work. The architecture of the NoIF forms the foundation for ULS computing platforms, delivering exceptional results as compared to SOTA solutions. The superior hardware efficiency and advanced inter-chiplet communication features of ChIP position this proposed protocol as an ideal candidate for chiplet communication in ULS architectures.
超大规模应用的芯片接口协议(ChIP)
随着计算工作负载的持续增长,基于芯片的系统的异构集成对于高性能计算、大型语言模型和人工智能等数据密集型应用程序变得至关重要。然而,由于网络架构和封装技术的限制,扩展到超大规模(ULS)系统带来了重大的通信挑战。在数千个小芯片的网络中高效的数据传输仍然是一个关键的瓶颈。本文提出了一种用于ULS系统的稳健、低延迟、区域和节能的通信架构——芯片接口协议(ChIP)。ChIP支持突发传输和乱序交易,同时利用芯片的简单通用并行接口(SuperCHIPS) -一种简单的区域和节能的物理层流通道。在晶圆级平台上进行评估,ChIP与最先进的(SOTA)基于芯片的接口(包括LIPINCON、BoW、UCIe和AIB)在性能、硬件效率和统一信令方面进行了比较。从比较结果来看,ChIP在每海岸线带宽方面明显优于SOTA替代方案(5.53倍),在流水线模式下达到2.2 Tbps/mm,在突发事务中高达7.3 Tbps/mm。此外,ChIP中每个链路的收发器面积比最佳SOTA替代品小46.1%,同时在0.5 mm链路上实现0.38-0.53 pJ/bit能量和1ns延迟,由于最小的握手和优化的点对点规格,在更长的通道和不同的封装中保持效率。在一个细间距集成平台上,对ChIP的性能进行了跨多种网络配置的评估,并对一种定制的混合拓扑进行了评估,该拓扑被称为互连结构网络(NoIF),在本工作中进行了介绍和分析。NoIF的体系结构构成了ULS计算平台的基础,与SOTA解决方案相比,它提供了卓越的结果。ChIP优越的硬件效率和先进的芯片间通信特性使该协议成为ULS架构中芯片通信的理想候选协议。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
CiteScore
8.50
自引率
2.20%
发文量
86
期刊介绍: The IEEE Journal on Emerging and Selected Topics in Circuits and Systems is published quarterly and solicits, with particular emphasis on emerging areas, special issues on topics that cover the entire scope of the IEEE Circuits and Systems (CAS) Society, namely the theory, analysis, design, tools, and implementation of circuits and systems, spanning their theoretical foundations, applications, and architectures for signal and information processing.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信
小红书