Halide Perovskite: The Key to Overcoming von Neumann Bottlenecks in AI Workloads

IF 3.1 4区 材料科学 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY
Geon Kim, Sunghyun Jang, Hyojung Kim
{"title":"Halide Perovskite: The Key to Overcoming von Neumann Bottlenecks in AI Workloads","authors":"Geon Kim,&nbsp;Sunghyun Jang,&nbsp;Hyojung Kim","doi":"10.1007/s13391-025-00597-1","DOIUrl":null,"url":null,"abstract":"<div><p>The well-known von Neumann bottleneck has emerged as a significant obstacle in computationally demanding AI tasks, as frequent data transfers between logic and memory impair system performance and reduce energy efficiency, thereby motivating the exploration of in-memory and neuromorphic computing as potential solutions. Among emerging material options, halide perovskites (HPs) exhibit a tunable bandgap, rapid ion migration, mechanical pliability, and facile low-temperature processing, making them particularly advantageous for next-generation computing. This article surveys HP-based memristors and synaptic transistors, emphasizing their underlying physical mechanisms, capacity to replicate synaptic behavior, and multilevel memory functionality within novel computing architectures. Additionally, we address integration challenges, particularly regarding stability, variability, and scalability. By examining recent advances, we highlight HPs as a promising materials platform for next-generation AI hardware that can overcome the limitations of traditional von Neumann architectures.</p><h3>Graphical Abstract</h3><div><figure><div><div><picture><source><img></source></picture></div></div></figure></div></div>","PeriodicalId":536,"journal":{"name":"Electronic Materials Letters","volume":"21 6","pages":"756 - 783"},"PeriodicalIF":3.1000,"publicationDate":"2025-09-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electronic Materials Letters","FirstCategoryId":"88","ListUrlMain":"https://link.springer.com/article/10.1007/s13391-025-00597-1","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0

Abstract

The well-known von Neumann bottleneck has emerged as a significant obstacle in computationally demanding AI tasks, as frequent data transfers between logic and memory impair system performance and reduce energy efficiency, thereby motivating the exploration of in-memory and neuromorphic computing as potential solutions. Among emerging material options, halide perovskites (HPs) exhibit a tunable bandgap, rapid ion migration, mechanical pliability, and facile low-temperature processing, making them particularly advantageous for next-generation computing. This article surveys HP-based memristors and synaptic transistors, emphasizing their underlying physical mechanisms, capacity to replicate synaptic behavior, and multilevel memory functionality within novel computing architectures. Additionally, we address integration challenges, particularly regarding stability, variability, and scalability. By examining recent advances, we highlight HPs as a promising materials platform for next-generation AI hardware that can overcome the limitations of traditional von Neumann architectures.

Graphical Abstract

卤化物钙钛矿:克服人工智能工作负载中冯诺依曼瓶颈的关键
众所周知的冯·诺伊曼瓶颈已经成为计算要求高的人工智能任务的一个重大障碍,因为在逻辑和内存之间频繁的数据传输损害了系统性能并降低了能源效率,因此激发了对内存和神经形态计算的探索,作为潜在的解决方案。在新兴的材料选择中,卤化物钙钛矿(HPs)具有可调的带隙,快速离子迁移,机械柔韧性和易于低温处理,使其对下一代计算特别有利。本文研究了基于hp的忆阻器和突触晶体管,强调了它们的基本物理机制、复制突触行为的能力以及新型计算体系结构中的多级存储功能。此外,我们还解决了集成方面的挑战,特别是在稳定性、可变性和可伸缩性方面。通过研究最近的进展,我们强调了惠普作为下一代人工智能硬件的有前途的材料平台,可以克服传统冯·诺伊曼架构的局限性。图形抽象
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Electronic Materials Letters
Electronic Materials Letters 工程技术-材料科学:综合
CiteScore
4.70
自引率
20.80%
发文量
52
审稿时长
2.3 months
期刊介绍: Electronic Materials Letters is an official journal of the Korean Institute of Metals and Materials. It is a peer-reviewed international journal publishing print and online version. It covers all disciplines of research and technology in electronic materials. Emphasis is placed on science, engineering and applications of advanced materials, including electronic, magnetic, optical, organic, electrochemical, mechanical, and nanoscale materials. The aspects of synthesis and processing include thin films, nanostructures, self assembly, and bulk, all related to thermodynamics, kinetics and/or modeling.
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