Jiacheng Tong , Jun Wang , Huimin Zhang , Haoran Liu , Youchang Sun , Zhiguo Li , Wenyi Zhang , Zhe Wang , Yanli Chang , Zhao Yuan , Henry Hu
{"title":"Performance evaluation of Cu-based contact material reinforced by the CuCrNiCoFe high entropy particles","authors":"Jiacheng Tong , Jun Wang , Huimin Zhang , Haoran Liu , Youchang Sun , Zhiguo Li , Wenyi Zhang , Zhe Wang , Yanli Chang , Zhao Yuan , Henry Hu","doi":"10.1016/j.wear.2025.206373","DOIUrl":null,"url":null,"abstract":"<div><div>In this study, Cu-based contact materials reinforced with 20 wt% high-entropy alloy particles of CuCrNiCoFe were successfully prepared by combining ball milling and spark plasma sintering (SPS) technology. The microstructure and fundamental physical properties of the novel Cu-20HEAs samples were investigated, and their arc erosion behavior was systematically evaluated. The results demonstrate that after low-speed ball milling for 3 h, the high entropy alloys (HEAs) particles achieved uniform distribution within the Cu matrix. Following SPS, the material exhibited excellent overall performance, with an electrical conductivity of 25.5 %IACS, a Vickers hardness of 90.1 HV, and a density of 8.77 g/cm<sup>3</sup>. The Cu-20HEAs samples displayed favorable resistance to arc erosion during vacuum arc breakdown testing. During arcing, a larger arc diffusion area facilitated rapid dispersion of arc energy, effectively suppressing splashing of the Cu matrix and minimizing mass loss. In 50 arc erosion tests, the dielectric strength of the sample exhibited minimal fluctuation, demonstrating excellent operational stability and a prolonged service life.</div></div>","PeriodicalId":23970,"journal":{"name":"Wear","volume":"584 ","pages":"Article 206373"},"PeriodicalIF":6.1000,"publicationDate":"2025-10-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Wear","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0043164825006428","RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, MECHANICAL","Score":null,"Total":0}
引用次数: 0
Abstract
In this study, Cu-based contact materials reinforced with 20 wt% high-entropy alloy particles of CuCrNiCoFe were successfully prepared by combining ball milling and spark plasma sintering (SPS) technology. The microstructure and fundamental physical properties of the novel Cu-20HEAs samples were investigated, and their arc erosion behavior was systematically evaluated. The results demonstrate that after low-speed ball milling for 3 h, the high entropy alloys (HEAs) particles achieved uniform distribution within the Cu matrix. Following SPS, the material exhibited excellent overall performance, with an electrical conductivity of 25.5 %IACS, a Vickers hardness of 90.1 HV, and a density of 8.77 g/cm3. The Cu-20HEAs samples displayed favorable resistance to arc erosion during vacuum arc breakdown testing. During arcing, a larger arc diffusion area facilitated rapid dispersion of arc energy, effectively suppressing splashing of the Cu matrix and minimizing mass loss. In 50 arc erosion tests, the dielectric strength of the sample exhibited minimal fluctuation, demonstrating excellent operational stability and a prolonged service life.
期刊介绍:
Wear journal is dedicated to the advancement of basic and applied knowledge concerning the nature of wear of materials. Broadly, topics of interest range from development of fundamental understanding of the mechanisms of wear to innovative solutions to practical engineering problems. Authors of experimental studies are expected to comment on the repeatability of the data, and whenever possible, conduct multiple measurements under similar testing conditions. Further, Wear embraces the highest standards of professional ethics, and the detection of matching content, either in written or graphical form, from other publications by the current authors or by others, may result in rejection.