Thermodynamic performance of a new composite honeycomb structure heat sink based on multi-objective co-optimization

IF 5 2区工程技术 Q1 ENGINEERING, MECHANICAL

International Journal of Thermal Sciences Pub Date : 2025-10-18 DOI:10.1016/j.ijthermalsci.2025.110406

Xiaoyu Zhang, Mengnan Ruan, Yifan Li, Jing Hu, Weixue Cao

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Abstract

The optimal design of the heat sink is the key to improve the safe and stable operation of the insulated gate bipolar transistor. In this paper, the traditional hexagonal honeycomb structure is broken through, and three new structures, pentagon, heptagon and octagon are introduced. First, the heat transfer and flow behavior of the four structures are studied at the same inlet velocity, and the thermal irreversibility is analyzed. It is found that the seven-sided structure has the best heat dissipation performance. Compared with the hexagonal honeycomb structure, the maximum temperature of the chip is reduced by 1.98 K; the pressure drop is increased by 17 % and the hydraulic thermal performance coefficient is increased by 12 %. To optimize the flow performance of the heptagonal structure, the optimal structure is obtained by mixing the heptagonal unit with the low thermal resistance hexagon. Second, the heat dissipation performance of the optimal structure is systematically analyzed at different inlet velocities. The results show that the higher heptagonal proportional nusselt number can be effectively improved, while placing it away from the inlet and the main channel reduces the pressure drop and total entropy loss. Finally, 0.4 m/s is determined as the optimal inlet velocity. At this time, the maximum temperature of the chip is slightly reduced, and the hydraulic thermal performance coefficient is increased by 9.4 %.

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基于多目标协同优化的新型复合蜂窝结构散热器热力学性能研究

散热片的优化设计是提高绝缘栅双极晶体管安全稳定工作的关键。本文突破了传统的六角形蜂窝结构，介绍了五角形、七角形和八角形三种新型结构。首先，在相同进口速度下，研究了四种结构的传热和流动行为，并分析了热不可逆性。研究发现，七面结构具有最佳的散热性能。与六方蜂窝结构相比，芯片最高温度降低1.98 K；压降提高了17%，水力热性能系数提高了12%。为了优化七方体结构的流动性能，将七方体单元与低热阻六边形单元混合得到最优结构。其次，系统分析了优化结构在不同进口速度下的散热性能。结果表明，高七方比努瑟尔数可以有效提高，远离进气道和主通道可以降低压降和总熵损失。最终确定0.4 m/s为最优进口速度。此时，芯片的最高温度略有降低，水热性能系数提高9.4%。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

International Journal of Thermal Sciences 工程技术-工程：机械

CiteScore

8.10

自引率

11.10%

发文量

531

审稿时长

55 days

期刊介绍： The International Journal of Thermal Sciences is a journal devoted to the publication of fundamental studies on the physics of transfer processes in general, with an emphasis on thermal aspects and also applied research on various processes, energy systems and the environment. Articles are published in English and French, and are subject to peer review. The fundamental subjects considered within the scope of the journal are: * Heat and relevant mass transfer at all scales (nano, micro and macro) and in all types of material (heterogeneous, composites, biological,...) and fluid flow * Forced, natural or mixed convection in reactive or non-reactive media * Single or multi–phase fluid flow with or without phase change * Near–and far–field radiative heat transfer * Combined modes of heat transfer in complex systems (for example, plasmas, biological, geological,...) * Multiscale modelling The applied research topics include: * Heat exchangers, heat pipes, cooling processes * Transport phenomena taking place in industrial processes (chemical, food and agricultural, metallurgical, space and aeronautical, automobile industries) * Nano–and micro–technology for energy, space, biosystems and devices * Heat transport analysis in advanced systems * Impact of energy–related processes on environment, and emerging energy systems The study of thermophysical properties of materials and fluids, thermal measurement techniques, inverse methods, and the developments of experimental methods are within the scope of the International Journal of Thermal Sciences which also covers the modelling, and numerical methods applied to thermal transfer.