Investigation of a rapid design method for flow and heat transfer performance of two-phase cooling plates in electronic device cooling

IF 6.4 2区 工程技术 Q1 MECHANICS
Da Shi , Benhao Yin , Xiancai Chen , Shen Du , Ya-Ling He
{"title":"Investigation of a rapid design method for flow and heat transfer performance of two-phase cooling plates in electronic device cooling","authors":"Da Shi ,&nbsp;Benhao Yin ,&nbsp;Xiancai Chen ,&nbsp;Shen Du ,&nbsp;Ya-Ling He","doi":"10.1016/j.icheatmasstransfer.2025.109762","DOIUrl":null,"url":null,"abstract":"<div><div>As one of the potential technologies to address electronic device cooling challenge, two-phase cooling plates require rapid prediction of the inter-channel flow distribution and heat source temperature for effective design. To this end, this study first developed a non-time-varying thermal network model for two-phase cooling plates, incorporating the thermal coupling effect among multiple heat sources and the thermal spreading resistance in multi-level heat conduction paths. Subsequently, a one-dimensional steady-state distributed parameter model was established to describe the flow and heat transfer process of two-phase refrigerant within cooling plates. Through linearization treatment, rapid simultaneous determination of parameters such as pressure, flow rate, and enthalpy across all computational units was achieved. Finally, by integrating these two models, a rapid simulation method for evaluating the flow and heat transfer performance of two-phase cooling plates was proposed. This method demonstrated strong universality and computational efficiency by solving linear equations only. Compared with Computational Fluid Dynamics and experimental results, the calculation errors for both heat source temperature and inter-channel flow distribution were less than 7 %. Furthermore, the effects of geometric parameters and uniform/non-uniform heat loads on cooling plate performance were analyzed using this method. This study can provide valuable references for the practical design of two-phase flow cooling plates used in cooling applications for steady thermal power distribution devices, such as power electronics and battery systems.</div></div>","PeriodicalId":332,"journal":{"name":"International Communications in Heat and Mass Transfer","volume":"169 ","pages":"Article 109762"},"PeriodicalIF":6.4000,"publicationDate":"2025-10-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Communications in Heat and Mass Transfer","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0735193325011881","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MECHANICS","Score":null,"Total":0}
引用次数: 0

Abstract

As one of the potential technologies to address electronic device cooling challenge, two-phase cooling plates require rapid prediction of the inter-channel flow distribution and heat source temperature for effective design. To this end, this study first developed a non-time-varying thermal network model for two-phase cooling plates, incorporating the thermal coupling effect among multiple heat sources and the thermal spreading resistance in multi-level heat conduction paths. Subsequently, a one-dimensional steady-state distributed parameter model was established to describe the flow and heat transfer process of two-phase refrigerant within cooling plates. Through linearization treatment, rapid simultaneous determination of parameters such as pressure, flow rate, and enthalpy across all computational units was achieved. Finally, by integrating these two models, a rapid simulation method for evaluating the flow and heat transfer performance of two-phase cooling plates was proposed. This method demonstrated strong universality and computational efficiency by solving linear equations only. Compared with Computational Fluid Dynamics and experimental results, the calculation errors for both heat source temperature and inter-channel flow distribution were less than 7 %. Furthermore, the effects of geometric parameters and uniform/non-uniform heat loads on cooling plate performance were analyzed using this method. This study can provide valuable references for the practical design of two-phase flow cooling plates used in cooling applications for steady thermal power distribution devices, such as power electronics and battery systems.
电子器件冷却中两相冷却板流动和传热性能的快速设计方法研究
作为解决电子器件冷却挑战的潜在技术之一,两相冷却板需要快速预测通道间流动分布和热源温度以进行有效设计。为此,本研究首先建立了两相冷却板的非时变热网络模型,该模型考虑了多个热源之间的热耦合效应和多级热传导路径中的热扩散阻力。随后,建立了描述两相制冷剂在冷却板内流动和传热过程的一维稳态分布参数模型。通过线性化处理,可以快速同时确定所有计算单元的压力、流速和焓等参数。最后,将这两个模型结合起来,提出了一种评估两相冷却板流动和传热性能的快速仿真方法。该方法仅解线性方程,具有较强的通用性和计算效率。与计算流体力学和实验结果比较,热源温度和通道间流动分布的计算误差均小于7%。此外,还分析了几何参数和均匀/非均匀热负荷对冷却板性能的影响。该研究可为电力电子、电池系统等稳态热配电设备冷却应用中两相流冷却板的实际设计提供有价值的参考。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
CiteScore
11.00
自引率
10.00%
发文量
648
审稿时长
32 days
期刊介绍: International Communications in Heat and Mass Transfer serves as a world forum for the rapid dissemination of new ideas, new measurement techniques, preliminary findings of ongoing investigations, discussions, and criticisms in the field of heat and mass transfer. Two types of manuscript will be considered for publication: communications (short reports of new work or discussions of work which has already been published) and summaries (abstracts of reports, theses or manuscripts which are too long for publication in full). Together with its companion publication, International Journal of Heat and Mass Transfer, with which it shares the same Board of Editors, this journal is read by research workers and engineers throughout the world.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信