Atomic surface of AlSi10Mg produced by novel green chemical mechanical polishing using hybrid abrasives and material removal mechanism elucidated by nanoscratching
Zeyun Wang , Zhenyu Zhang , Yujie Chen , Jingsheng Luo , Jiang Li , Jianjun Hu , Longliang Huang , Pengfei Hu , Haisong Huang
{"title":"Atomic surface of AlSi10Mg produced by novel green chemical mechanical polishing using hybrid abrasives and material removal mechanism elucidated by nanoscratching","authors":"Zeyun Wang , Zhenyu Zhang , Yujie Chen , Jingsheng Luo , Jiang Li , Jianjun Hu , Longliang Huang , Pengfei Hu , Haisong Huang","doi":"10.1016/j.triboint.2025.111310","DOIUrl":null,"url":null,"abstract":"<div><div>A new green chemical mechanical polishing (CMP) was developed for AlSi10Mg, including hybrid abrasives of silica, yttria and ceria, polyethylene glycol, sodium metasilicate, threonine and hydrogen peroxide. After CMP, atomic surface with surface roughness Sa of 0.174 nm is achieved, and material removal rate is 21.57 μm/h. Transmission electron spectroscopy (TEM) confirms that the thickness of damaged layer is 3.4 nm. To the best of our knowledge, surface roughness and thickness of damaged layer of AlSi10Mg are both the lowest, compared with those published hitherto. Nanoscratching was conducted by molecular dynamics simulations. When the nanoscratching depth decreased from 3 to 2 nm, the thickness of damaged layer reduced from 3.9 to 3.4 nm, which agrees well with characterizations of TEM.</div></div>","PeriodicalId":23238,"journal":{"name":"Tribology International","volume":"214 ","pages":"Article 111310"},"PeriodicalIF":6.1000,"publicationDate":"2025-10-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Tribology International","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0301679X25008059","RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, MECHANICAL","Score":null,"Total":0}
引用次数: 0
Abstract
A new green chemical mechanical polishing (CMP) was developed for AlSi10Mg, including hybrid abrasives of silica, yttria and ceria, polyethylene glycol, sodium metasilicate, threonine and hydrogen peroxide. After CMP, atomic surface with surface roughness Sa of 0.174 nm is achieved, and material removal rate is 21.57 μm/h. Transmission electron spectroscopy (TEM) confirms that the thickness of damaged layer is 3.4 nm. To the best of our knowledge, surface roughness and thickness of damaged layer of AlSi10Mg are both the lowest, compared with those published hitherto. Nanoscratching was conducted by molecular dynamics simulations. When the nanoscratching depth decreased from 3 to 2 nm, the thickness of damaged layer reduced from 3.9 to 3.4 nm, which agrees well with characterizations of TEM.
期刊介绍:
Tribology is the science of rubbing surfaces and contributes to every facet of our everyday life, from live cell friction to engine lubrication and seismology. As such tribology is truly multidisciplinary and this extraordinary breadth of scientific interest is reflected in the scope of Tribology International.
Tribology International seeks to publish original research papers of the highest scientific quality to provide an archival resource for scientists from all backgrounds. Written contributions are invited reporting experimental and modelling studies both in established areas of tribology and emerging fields. Scientific topics include the physics or chemistry of tribo-surfaces, bio-tribology, surface engineering and materials, contact mechanics, nano-tribology, lubricants and hydrodynamic lubrication.