Analysis of Subsurface Damage Based on K9 Glass Grinding.

IF 3.2 3区 材料科学 Q3 CHEMISTRY, PHYSICAL
Materials Pub Date : 2025-09-30 DOI:10.3390/ma18194558
Yao Liu, Jingjing Xie, Ruiliang Li, Jiankun Gao, Ming Li, Lin Sun
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引用次数: 0

Abstract

During the grinding process of K9 glass, various forms of surface damage-such as indentations and pitting-as well as subsurface damage-including cracks and residual stress-are generated. This paper focuses on the planetary grinding method utilizing bonded abrasives for both process research and subsurface damage detection. It examines the timeliness of grinding duration and analyzes the effects of abrasive grain size and grinding pressure on surface quality. Building upon the principle of differential etching, an improved HF chemical etching method is proposed to establish a relationship model that correlates the depth of subsurface damage with abrasive grain size, applied pressure, and surface roughness.

基于K9玻璃磨削的亚表面损伤分析。
在K9玻璃的磨削过程中,会产生各种形式的表面损伤,如压痕和点蚀,以及包括裂纹和残余应力在内的亚表面损伤。本文主要研究了利用结合磨料进行行星磨削的工艺研究和亚表面损伤检测。考察了磨削时间的时效性,分析了磨料粒度和磨削压力对表面质量的影响。基于差分刻蚀原理,提出了一种改进的高频化学刻蚀方法,建立了亚表面损伤深度与磨料粒度、施加压力和表面粗糙度之间的关系模型。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Materials
Materials MATERIALS SCIENCE, MULTIDISCIPLINARY-
CiteScore
5.80
自引率
14.70%
发文量
7753
审稿时长
1.2 months
期刊介绍: Materials (ISSN 1996-1944) is an open access journal of related scientific research and technology development. It publishes reviews, regular research papers (articles) and short communications. Our aim is to encourage scientists to publish their experimental and theoretical results in as much detail as possible. Therefore, there is no restriction on the length of the papers. The full experimental details must be provided so that the results can be reproduced. Materials provides a forum for publishing papers which advance the in-depth understanding of the relationship between the structure, the properties or the functions of all kinds of materials. Chemical syntheses, chemical structures and mechanical, chemical, electronic, magnetic and optical properties and various applications will be considered.
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