Microwave shielding behavior of conductive silk fabric and bamboo fiber reinforced green-synthesized NiO particle epoxy composite at E, F, I and J band frequencies

Abstract

The primary aim of this study was to develop and assess the EMI (Electromagnetic Interference) shielding behavior of epoxy-based composites that incorporated silk fabric and bamboo fiber enriched with green-synthesized nickel oxide particles. The NiO nanoparticles are prepared from waste onion peels and confirmed using X-ray diffraction analysis. These composite laminates were created using the hand layup method, ensuring the uniform dispersion of their constituents within the epoxy matrix. The study involved characterizing the resulting composite according to ASTM standards, and its mechanical, dielectric, and EMI shielding properties were thoroughly investigated. The results of the mechanical analysis demonstrated a significant improvement in both tensile and flexural strength for the composite designated as ES2, with values of 180.4 MPa and 237.6 MPa, respectively. Furthermore, ES2 also exhibited enhanced hardness values along with impressive impact energy of 6.84 J. Dielectric analysis revealed remarkable dielectric constants of 6.16, 3.41, 1.98, and 0.75 across various frequency bands, such as E, F, I and J microwave frequency bands. In terms of EMI shielding, the composite designated as ES2 displayed notable values of 7.04 dB, 16.92 dB, 37.51 dB, and 53.13 dB for total EMI shielding across different frequency bands. These findings underscore the material's potential for versatile EMI mitigation properties. The study highlights the capabilities of Nickel oxide-enriched epoxy-composites with silk fabric and bamboo fiber as highly effective EMI shielding materials. Composites that offer good shielding, dielectric, and mechanical properties have extensive potential applications in fields, such as satellites, defense, industries, aerospace, and the electronic sector. The research demonstrates the importance of developing advanced materials to address the growing challenges of electromagnetic interference in various technological applications.