{"title":"Enhanced adhesion of PTFE with ultra-low dielectric constant by a non-destructive surface treatment","authors":"Jianbo Wang, Yong Fan, Yuliang Yao, Liyu Hao, Peipei Wang, Engang Fu","doi":"10.1016/j.apsusc.2025.164878","DOIUrl":null,"url":null,"abstract":"With the rapid development of communication technology, low dielectric constant (low-k) materials have become increasingly important. Polytetrafluoroethylene (PTFE) stands out due to its ultra-low dielectric constant. However, the low surface tension of PTFE results in insufficient peeling strength with copper foil, limiting its application in integrated circuits. In this study, a novel strategy involving the use of a SiO<sub>2</sub> emulsion and Ar plasma treatment is developed to enhance the peeling strength between PTFE and copper foil while maintaining the low dielectric constant of PTFE. The results show that the peeling strength between the PTFE membrane and copper foil is significantly improved, reaching 0.98 N/mm after three treatments, while the dielectric constant of the PTFE membrane remained low at 2.08 (1.98 without treating) and 1.99 (2.01 without treating) at 2.5 GHz and 5 GHz, respectively, lower than the dielectric constant of PI (∼3.4), the most commonly used dielectric materials of cover layers on flexible printed circuit (FPC) today. The elongation at break of the PTFE membrane also maintained at 122.4 %. The formation of Si-O-C bonds played a crucial role in enhancing the peeling strength, providing a strong and stable interface between the PTFE membrane and the copper foil.","PeriodicalId":247,"journal":{"name":"Applied Surface Science","volume":"52 1","pages":""},"PeriodicalIF":6.9000,"publicationDate":"2025-10-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Applied Surface Science","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1016/j.apsusc.2025.164878","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"CHEMISTRY, PHYSICAL","Score":null,"Total":0}
引用次数: 0
Abstract
With the rapid development of communication technology, low dielectric constant (low-k) materials have become increasingly important. Polytetrafluoroethylene (PTFE) stands out due to its ultra-low dielectric constant. However, the low surface tension of PTFE results in insufficient peeling strength with copper foil, limiting its application in integrated circuits. In this study, a novel strategy involving the use of a SiO2 emulsion and Ar plasma treatment is developed to enhance the peeling strength between PTFE and copper foil while maintaining the low dielectric constant of PTFE. The results show that the peeling strength between the PTFE membrane and copper foil is significantly improved, reaching 0.98 N/mm after three treatments, while the dielectric constant of the PTFE membrane remained low at 2.08 (1.98 without treating) and 1.99 (2.01 without treating) at 2.5 GHz and 5 GHz, respectively, lower than the dielectric constant of PI (∼3.4), the most commonly used dielectric materials of cover layers on flexible printed circuit (FPC) today. The elongation at break of the PTFE membrane also maintained at 122.4 %. The formation of Si-O-C bonds played a crucial role in enhancing the peeling strength, providing a strong and stable interface between the PTFE membrane and the copper foil.
期刊介绍:
Applied Surface Science covers topics contributing to a better understanding of surfaces, interfaces, nanostructures and their applications. The journal is concerned with scientific research on the atomic and molecular level of material properties determined with specific surface analytical techniques and/or computational methods, as well as the processing of such structures.