Enhanced adhesion of PTFE with ultra-low dielectric constant by a non-destructive surface treatment

IF 6.9 2区 材料科学 Q2 CHEMISTRY, PHYSICAL
Jianbo Wang, Yong Fan, Yuliang Yao, Liyu Hao, Peipei Wang, Engang Fu
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Abstract

With the rapid development of communication technology, low dielectric constant (low-k) materials have become increasingly important. Polytetrafluoroethylene (PTFE) stands out due to its ultra-low dielectric constant. However, the low surface tension of PTFE results in insufficient peeling strength with copper foil, limiting its application in integrated circuits. In this study, a novel strategy involving the use of a SiO2 emulsion and Ar plasma treatment is developed to enhance the peeling strength between PTFE and copper foil while maintaining the low dielectric constant of PTFE. The results show that the peeling strength between the PTFE membrane and copper foil is significantly improved, reaching 0.98 N/mm after three treatments, while the dielectric constant of the PTFE membrane remained low at 2.08 (1.98 without treating) and 1.99 (2.01 without treating) at 2.5 GHz and 5 GHz, respectively, lower than the dielectric constant of PI (∼3.4), the most commonly used dielectric materials of cover layers on flexible printed circuit (FPC) today. The elongation at break of the PTFE membrane also maintained at 122.4 %. The formation of Si-O-C bonds played a crucial role in enhancing the peeling strength, providing a strong and stable interface between the PTFE membrane and the copper foil.

Abstract Image

通过非破坏性表面处理,以超低介电常数增强聚四氟乙烯的附着力
随着通信技术的飞速发展,低介电常数(low-k)材料变得越来越重要。聚四氟乙烯(PTFE)因其超低介电常数而脱颖而出。然而,由于PTFE表面张力低,导致其与铜箔的剥离强度不足,限制了其在集成电路中的应用。在这项研究中,开发了一种新的策略,包括使用SiO2乳液和Ar等离子体处理,以提高PTFE和铜箔之间的剥离强度,同时保持PTFE的低介电常数。结果表明,经过三次处理后,PTFE膜与铜箔之间的剥离强度显著提高,达到0.98 N/mm,而在2.5 GHz和5 GHz下,PTFE膜的介电常数分别保持在2.08(未经处理的1.98)和1.99(未经处理的2.01),低于目前柔性印刷电路(FPC)覆盖层最常用的介电材料PI(~ 3.4)的介电常数。PTFE膜的断裂伸长率也保持在122.4 %。Si-O-C键的形成对提高剥离强度起着至关重要的作用,在PTFE膜和铜箔之间提供了一个强大而稳定的界面。
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来源期刊
Applied Surface Science
Applied Surface Science 工程技术-材料科学:膜
CiteScore
12.50
自引率
7.50%
发文量
3393
审稿时长
67 days
期刊介绍: Applied Surface Science covers topics contributing to a better understanding of surfaces, interfaces, nanostructures and their applications. The journal is concerned with scientific research on the atomic and molecular level of material properties determined with specific surface analytical techniques and/or computational methods, as well as the processing of such structures.
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