Crístofer Hood Marques , Jeferson Avila Souza , Chaianan Sailabada , Juan C. Ordonez
{"title":"Parametric study of a cold plate for electronic systems cooling","authors":"Crístofer Hood Marques , Jeferson Avila Souza , Chaianan Sailabada , Juan C. Ordonez","doi":"10.1016/j.tsep.2025.104172","DOIUrl":null,"url":null,"abstract":"<div><div>The International Maritime Organization’s goal of achieving net-zero greenhouse gas emissions by around 2050 made full electric ships draw attention as a means to achieve this target. Effective thermal management systems are crucial for electric ships to dissipate heat and prevent overheating of critical components. The present study aims to investigate the effect of geometric and non-geometric variables on the technical viability of a cold plate intended to cool a Power Electronics Building Block. A combination of four open-source software packages and one transport properties library was used to simulate the effect of four decision variables on five measures of merit. One design was considered with a novel S-type pipe shape and different values for the plate aspect ratio, radius ratio of the pipe, flow pressure loss, and plate mass. Results show that increasing plate mass and allowable pressure loss significantly reduce global thermal resistance and exergy destruction. Temperature distribution and usable area are highly sensitive to the geometric configuration. The proposed design index effectively captures the trade-off between thermal performance and system-level constraints, including weight and pumping power. The study recommends increasing decision variable values, but the best configuration ranking depends on the chosen measure of merit.</div></div>","PeriodicalId":23062,"journal":{"name":"Thermal Science and Engineering Progress","volume":"67 ","pages":"Article 104172"},"PeriodicalIF":5.4000,"publicationDate":"2025-10-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Thermal Science and Engineering Progress","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S2451904925009631","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENERGY & FUELS","Score":null,"Total":0}
引用次数: 0
Abstract
The International Maritime Organization’s goal of achieving net-zero greenhouse gas emissions by around 2050 made full electric ships draw attention as a means to achieve this target. Effective thermal management systems are crucial for electric ships to dissipate heat and prevent overheating of critical components. The present study aims to investigate the effect of geometric and non-geometric variables on the technical viability of a cold plate intended to cool a Power Electronics Building Block. A combination of four open-source software packages and one transport properties library was used to simulate the effect of four decision variables on five measures of merit. One design was considered with a novel S-type pipe shape and different values for the plate aspect ratio, radius ratio of the pipe, flow pressure loss, and plate mass. Results show that increasing plate mass and allowable pressure loss significantly reduce global thermal resistance and exergy destruction. Temperature distribution and usable area are highly sensitive to the geometric configuration. The proposed design index effectively captures the trade-off between thermal performance and system-level constraints, including weight and pumping power. The study recommends increasing decision variable values, but the best configuration ranking depends on the chosen measure of merit.
期刊介绍:
Thermal Science and Engineering Progress (TSEP) publishes original, high-quality research articles that span activities ranging from fundamental scientific research and discussion of the more controversial thermodynamic theories, to developments in thermal engineering that are in many instances examples of the way scientists and engineers are addressing the challenges facing a growing population – smart cities and global warming – maximising thermodynamic efficiencies and minimising all heat losses. It is intended that these will be of current relevance and interest to industry, academia and other practitioners. It is evident that many specialised journals in thermal and, to some extent, in fluid disciplines tend to focus on topics that can be classified as fundamental in nature, or are ‘applied’ and near-market. Thermal Science and Engineering Progress will bridge the gap between these two areas, allowing authors to make an easy choice, should they or a journal editor feel that their papers are ‘out of scope’ when considering other journals. The range of topics covered by Thermal Science and Engineering Progress addresses the rapid rate of development being made in thermal transfer processes as they affect traditional fields, and important growth in the topical research areas of aerospace, thermal biological and medical systems, electronics and nano-technologies, renewable energy systems, food production (including agriculture), and the need to minimise man-made thermal impacts on climate change. Review articles on appropriate topics for TSEP are encouraged, although until TSEP is fully established, these will be limited in number. Before submitting such articles, please contact one of the Editors, or a member of the Editorial Advisory Board with an outline of your proposal and your expertise in the area of your review.