Effect of indium (In) on the microstructure evolution, grain orientation and mechanical behaviors of Sn58Bi/Cu solder joints under thermal cycling

IF 5.5 2区材料科学 Q1 MATERIALS SCIENCE, CHARACTERIZATION & TESTING

Materials Characterization Pub Date : 2025-10-02 DOI:10.1016/j.matchar.2025.115608

Wenhao Wang , Lei Sun , Peng He , Liang Zhang , Jing Li , Shuye Zhang

{"title":"Effect of indium (In) on the microstructure evolution, grain orientation and mechanical behaviors of Sn58Bi/Cu solder joints under thermal cycling","authors":"Wenhao Wang , Lei Sun , Peng He , Liang Zhang , Jing Li , Shuye Zhang","doi":"10.1016/j.matchar.2025.115608","DOIUrl":null,"url":null,"abstract":"<div><div>The effects of adding 0.3 wt% submicron-sized indium (In) particles on the microstructure evolution, grain orientation, and mechanical behaviors of the Sn58Bi solder joints under thermal cycling were systematically characterized. The results reveal that In particles can promote microstructure refinement of Sn58Bi/Cu solder joint and suppress the coarsening and segregation of the Bi phase. At the Sn58Bi/Cu interface, In promoted the rapid formation of the Cu<sub>6</sub>(Sn,In)<sub>5</sub> IMC layer, but inhibited the growth of the brittle Cu<sub>3</sub>Sn layer. After 1200 thermal cycles, the thickness of IMC layer of the Sn58Bi/Cu and Sn58Bi-0.3In/Cu solder joints was 3.964 μm and 4.781 μm, respectively. Moreover, the IMC grains of Sn58Bi-0.3In/Cu solder joint were larger than those of the Sn58Bi/Cu solder joint under thermal cycling. Through EBSD analysis, the addition of In particles improved the grain orientation consistency of the microstructure of Sn58Bi/Cu, achieving directional regulation of the interfacial IMC. In addition, the shear strength and microhardness of Sn58Bi/Cu solder joints were enhanced with In particles, maintaining a 9.6 % higher shear strength and 16.7 % higher microhardness than unmodified Sn58Bi under 1200 thermal cycles.</div></div>","PeriodicalId":18727,"journal":{"name":"Materials Characterization","volume":"229 ","pages":"Article 115608"},"PeriodicalIF":5.5000,"publicationDate":"2025-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Materials Characterization","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1044580325008976","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MATERIALS SCIENCE, CHARACTERIZATION & TESTING","Score":null,"Total":0}

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Abstract

The effects of adding 0.3 wt% submicron-sized indium (In) particles on the microstructure evolution, grain orientation, and mechanical behaviors of the Sn58Bi solder joints under thermal cycling were systematically characterized. The results reveal that In particles can promote microstructure refinement of Sn58Bi/Cu solder joint and suppress the coarsening and segregation of the Bi phase. At the Sn58Bi/Cu interface, In promoted the rapid formation of the Cu₆(Sn,In)₅ IMC layer, but inhibited the growth of the brittle Cu₃Sn layer. After 1200 thermal cycles, the thickness of IMC layer of the Sn58Bi/Cu and Sn58Bi-0.3In/Cu solder joints was 3.964 μm and 4.781 μm, respectively. Moreover, the IMC grains of Sn58Bi-0.3In/Cu solder joint were larger than those of the Sn58Bi/Cu solder joint under thermal cycling. Through EBSD analysis, the addition of In particles improved the grain orientation consistency of the microstructure of Sn58Bi/Cu, achieving directional regulation of the interfacial IMC. In addition, the shear strength and microhardness of Sn58Bi/Cu solder joints were enhanced with In particles, maintaining a 9.6 % higher shear strength and 16.7 % higher microhardness than unmodified Sn58Bi under 1200 thermal cycles.

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热循环条件下铟（In）对Sn58Bi/Cu焊点组织演变、晶粒取向和力学行为的影响

研究了添加0.3 wt%亚微米级铟（In）对Sn58Bi焊点热循环组织演变、晶粒取向和力学行为的影响。结果表明：In颗粒能促进Sn58Bi/Cu焊点组织细化，抑制Bi相的粗化和偏析；在Sn58Bi/Cu界面处，In促进了Cu6(Sn,In)5 IMC层的快速形成，但抑制了脆性Cu3Sn层的生长。经过1200次热循环后，Sn58Bi/Cu和Sn58Bi-0.3 in /Cu焊点的IMC层厚度分别为3.964 μm和4.781 μm。此外，Sn58Bi-0.3 in /Cu焊点的IMC晶粒比Sn58Bi/Cu焊点的IMC晶粒大。通过EBSD分析，In颗粒的加入提高了Sn58Bi/Cu微观结构的晶粒取向一致性，实现了界面IMC的定向调节。此外，在1200次热循环下，加入In的Sn58Bi/Cu钎料的抗剪强度和显微硬度比未加入In的Sn58Bi钎料的抗剪强度和显微硬度分别提高了9.6%和16.7%。

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来源期刊

Materials Characterization 工程技术-材料科学：表征与测试

CiteScore

7.60

自引率

8.50%

发文量

746

审稿时长

36 days

期刊介绍： Materials Characterization features original articles and state-of-the-art reviews on theoretical and practical aspects of the structure and behaviour of materials. The Journal focuses on all characterization techniques, including all forms of microscopy (light, electron, acoustic, etc.,) and analysis (especially microanalysis and surface analytical techniques). Developments in both this wide range of techniques and their application to the quantification of the microstructure of materials are essential facets of the Journal. The Journal provides the Materials Scientist/Engineer with up-to-date information on many types of materials with an underlying theme of explaining the behavior of materials using novel approaches. Materials covered by the journal include: Metals & Alloys Ceramics Nanomaterials Biomedical materials Optical materials Composites Natural Materials.