A MEMS wall shear stress sensor with floating cover plate for aerospace flow monitoring in harsh environments.

IF 9.9 1区 工程技术 Q1 INSTRUMENTS & INSTRUMENTATION
Yunzhe Liu, Chuqiao Wang, Guanghui Ding, Xingxu Zhang, Jinjun Deng, Yang He, Binghe Ma, Weizheng Yuan
{"title":"A MEMS wall shear stress sensor with floating cover plate for aerospace flow monitoring in harsh environments.","authors":"Yunzhe Liu, Chuqiao Wang, Guanghui Ding, Xingxu Zhang, Jinjun Deng, Yang He, Binghe Ma, Weizheng Yuan","doi":"10.1038/s41378-025-01050-x","DOIUrl":null,"url":null,"abstract":"<p><p>Wall shear stress is one of the key parameters in turbulent boundary layers, playing a pivotal role in aerodynamic optimization and fuel efficiency enhancement. Although MEMS-based direct measurement stands as the most promising approach for wall shear stress quantification, the inherent limitations of floating sensing structures under harsh environments lead to mechanical failure, representing persistent technical barriers in practical applications. This work presents a novel MEMS sensor equipped with a protective floating cover plate, achieving high-robustness measurement through coordinated structural-process innovations. Based on the Dual Silicon-On-Insulator (DSOI) fabrication process, a protective floating configuration is developed. The critical process techniques, including deep silicon etching, wet etching of glass through vias, and silicon-glass anodic bonding synergistically establish protection for the sensing structures. The established electromechanical coupling mathematical model elucidates quantitative mapping relationships between critical structural parameters and sensing performance. Experimental characterization reveals a linear sensitivity of 28.3 mV Pa<sup>-1</sup> and a resonance frequency of 2.9 kHz. In supersonic tunnel experiments at Mach 2.0, the sensor achieves unprecedented full-cycle dynamic capture from establishment through stabilization to dissipation with millisecond-level transient response characteristics. This work provides a robust, high-precision solution for aerodynamic and fluid dynamics applications, paving the way for improving energy efficiency and flow control strategies.</p>","PeriodicalId":18560,"journal":{"name":"Microsystems & Nanoengineering","volume":"11 1","pages":"183"},"PeriodicalIF":9.9000,"publicationDate":"2025-10-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.ncbi.nlm.nih.gov/pmc/articles/PMC12511368/pdf/","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microsystems & Nanoengineering","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1038/s41378-025-01050-x","RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"INSTRUMENTS & INSTRUMENTATION","Score":null,"Total":0}
引用次数: 0

Abstract

Wall shear stress is one of the key parameters in turbulent boundary layers, playing a pivotal role in aerodynamic optimization and fuel efficiency enhancement. Although MEMS-based direct measurement stands as the most promising approach for wall shear stress quantification, the inherent limitations of floating sensing structures under harsh environments lead to mechanical failure, representing persistent technical barriers in practical applications. This work presents a novel MEMS sensor equipped with a protective floating cover plate, achieving high-robustness measurement through coordinated structural-process innovations. Based on the Dual Silicon-On-Insulator (DSOI) fabrication process, a protective floating configuration is developed. The critical process techniques, including deep silicon etching, wet etching of glass through vias, and silicon-glass anodic bonding synergistically establish protection for the sensing structures. The established electromechanical coupling mathematical model elucidates quantitative mapping relationships between critical structural parameters and sensing performance. Experimental characterization reveals a linear sensitivity of 28.3 mV Pa-1 and a resonance frequency of 2.9 kHz. In supersonic tunnel experiments at Mach 2.0, the sensor achieves unprecedented full-cycle dynamic capture from establishment through stabilization to dissipation with millisecond-level transient response characteristics. This work provides a robust, high-precision solution for aerodynamic and fluid dynamics applications, paving the way for improving energy efficiency and flow control strategies.

一种用于恶劣环境下航空航天流量监测的浮盖板MEMS壁面剪应力传感器。
壁面剪切应力是湍流边界层的关键参数之一,在气动优化和燃油效率提高中起着举足轻重的作用。尽管基于mems的直接测量是最具前景的墙体剪切应力量化方法,但浮式传感结构在恶劣环境下的固有局限性会导致机械故障,这是实际应用中持续存在的技术障碍。这项工作提出了一种新型的MEMS传感器,配备了一个保护浮动盖板,通过协调的结构工艺创新实现了高鲁棒性测量。基于双绝缘子上硅(DSOI)的制造工艺,开发了一种保护浮子结构。关键的工艺技术,包括深硅蚀刻、湿法蚀刻玻璃通孔和硅-玻璃阳极键合,协同建立对传感结构的保护。建立的机电耦合数学模型阐明了关键结构参数与传感性能之间的定量映射关系。实验表征表明,线性灵敏度为28.3 mV Pa-1,共振频率为2.9 kHz。在2.0马赫的超音速隧道实验中,该传感器实现了前所未有的从建立到稳定到耗散的全周期动态捕获,具有毫秒级的瞬态响应特性。这项工作为气动和流体动力学应用提供了一个强大的、高精度的解决方案,为提高能源效率和流动控制策略铺平了道路。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
Microsystems & Nanoengineering
Microsystems & Nanoengineering Materials Science-Materials Science (miscellaneous)
CiteScore
12.00
自引率
3.80%
发文量
123
审稿时长
20 weeks
期刊介绍: Microsystems & Nanoengineering is a comprehensive online journal that focuses on the field of Micro and Nano Electro Mechanical Systems (MEMS and NEMS). It provides a platform for researchers to share their original research findings and review articles in this area. The journal covers a wide range of topics, from fundamental research to practical applications. Published by Springer Nature, in collaboration with the Aerospace Information Research Institute, Chinese Academy of Sciences, and with the support of the State Key Laboratory of Transducer Technology, it is an esteemed publication in the field. As an open access journal, it offers free access to its content, allowing readers from around the world to benefit from the latest developments in MEMS and NEMS.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信