Three-dimensional shrinking electronics on freestanding and freeform curvilinear surfaces

IF 12.5 1区综合性期刊 Q1 MULTIDISCIPLINARY SCIENCES

Science Advances Pub Date : 2025-10-08 DOI:10.1126/sciadv.aea8051

Yangbo Yuan, Dongliang Chen, Jianyu Li, Bowen Li, Abu Musa Abdullah, Fatema Tuz Zohra, Wanqing Zhang, Xianzhe Zhang, Xin Xin, Mohammad Ali Amidian, Ankan Dutta, Feifei Shi, Huanyu Cheng

{"title":"Three-dimensional shrinking electronics on freestanding and freeform curvilinear surfaces","authors":"Yangbo Yuan, Dongliang Chen, Jianyu Li, Bowen Li, Abu Musa Abdullah, Fatema Tuz Zohra, Wanqing Zhang, Xianzhe Zhang, Xin Xin, Mohammad Ali Amidian, Ankan Dutta, Feifei Shi, Huanyu Cheng","doi":"10.1126/sciadv.aea8051","DOIUrl":null,"url":null,"abstract":"<div >Wearable electronics that adapt to three-dimensional (3D) surfaces are essential for next-generation smart internet of things (IoT), yet existing strategies remain limited because of fabrication complexity, material incompatibility, or poor structural control. Here, this work introduces a scalable yet versatile approach to design and fabricate 3D electronic systems by printing liquid metal patterns onto heat-shrinkable polymer substrates. Upon controlled thermal actuation, the 2D circuits transform into target 3D geometries with enhanced electrical performance. The resulting 3D shrinking electronics enable conformal antenna integration for IoT devices and gesture-interactive wearable interfaces. This low-cost, versatile platform offers a paradigm for customizable, shape-adaptive electronics in intelligent real and virtual environments.</div>","PeriodicalId":21609,"journal":{"name":"Science Advances","volume":"11 41","pages":""},"PeriodicalIF":12.5000,"publicationDate":"2025-10-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.science.org/doi/reader/10.1126/sciadv.aea8051","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Science Advances","FirstCategoryId":"103","ListUrlMain":"https://www.science.org/doi/10.1126/sciadv.aea8051","RegionNum":1,"RegionCategory":"综合性期刊","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MULTIDISCIPLINARY SCIENCES","Score":null,"Total":0}

引用次数: 0

Abstract

Wearable electronics that adapt to three-dimensional (3D) surfaces are essential for next-generation smart internet of things (IoT), yet existing strategies remain limited because of fabrication complexity, material incompatibility, or poor structural control. Here, this work introduces a scalable yet versatile approach to design and fabricate 3D electronic systems by printing liquid metal patterns onto heat-shrinkable polymer substrates. Upon controlled thermal actuation, the 2D circuits transform into target 3D geometries with enhanced electrical performance. The resulting 3D shrinking electronics enable conformal antenna integration for IoT devices and gesture-interactive wearable interfaces. This low-cost, versatile platform offers a paradigm for customizable, shape-adaptive electronics in intelligent real and virtual environments.

Abstract Image

查看原文本刊更多论文

在独立和自由曲面上的三维收缩电子学

适应三维（3D）表面的可穿戴电子设备对于下一代智能物联网（IoT）至关重要，但由于制造复杂性、材料不兼容性或结构控制不佳，现有的策略仍然有限。在这里，这项工作引入了一种可扩展但通用的方法，通过在热收缩聚合物基板上打印液态金属图案来设计和制造3D电子系统。在受控的热驱动下，二维电路转换成具有增强电气性能的目标三维几何形状。由此产生的3D收缩电子器件使物联网设备和手势交互可穿戴界面的共形天线集成成为可能。这种低成本、多功能的平台为智能真实和虚拟环境中的可定制、形状自适应电子产品提供了一种范例。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文求助全文

来源期刊

Science Advances 综合性期刊-综合性期刊

CiteScore

21.40

自引率

1.50%

发文量

1937

审稿时长

29 weeks

期刊介绍： Science Advances, an open-access journal by AAAS, publishes impactful research in diverse scientific areas. It aims for fair, fast, and expert peer review, providing freely accessible research to readers. Led by distinguished scientists, the journal supports AAAS's mission by extending Science magazine's capacity to identify and promote significant advances. Evolving digital publishing technologies play a crucial role in advancing AAAS's global mission for science communication and benefitting humankind.