Spherical Indentation on a Piezoelectric Semiconductor Film/Elastic Substrate System

IF 2.7 3区 工程技术 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY
Shijing Gao, Guoquan Nie, Jinxi Liu, Weiqiu Chen
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引用次数: 0

Abstract

We study the axisymmetric frictionless indentation problem of a piezoelectric semiconductor (PSC) thin film perfectly bonded to a semi-infinite isotropic elastic substrate by a rigid and insulating spherical indenter. The Hankel integral transformation is first employed to derive the general solutions for the governing differential equations of the PSC film and elastic substrate. Then, using the boundary and interface conditions, the complicated indentation problem is reduced to numerically solve a Fredholm integral equation of the second kind. Numerical results are given to demonstrate the effects of semiconducting property, film thickness as well as Young’s modulus and Poisson’s ratio of the substrate on the indentation responses. The obtained findings will contribute to the establishment of indentation experiments for PSC film/substrate systems.

压电半导体薄膜/弹性基板系统的球形压痕
本文研究了压电半导体(PSC)薄膜与半无限各向同性弹性衬底完美结合的轴对称无摩擦压痕问题。首先利用Hankel积分变换导出了PSC薄膜和弹性衬底控制微分方程的通解。然后,利用边界和界面条件,将复杂的压痕问题简化为数值求解第二类Fredholm积分方程。数值结果表明了半导体特性、薄膜厚度以及衬底的杨氏模量和泊松比对压痕响应的影响。所得结果将有助于PSC薄膜/衬底系统压痕实验的建立。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Acta Mechanica Solida Sinica
Acta Mechanica Solida Sinica 物理-材料科学:综合
CiteScore
3.80
自引率
9.10%
发文量
1088
审稿时长
9 months
期刊介绍: Acta Mechanica Solida Sinica aims to become the best journal of solid mechanics in China and a worldwide well-known one in the field of mechanics, by providing original, perspective and even breakthrough theories and methods for the research on solid mechanics. The Journal is devoted to the publication of research papers in English in all fields of solid-state mechanics and its related disciplines in science, technology and engineering, with a balanced coverage on analytical, experimental, numerical and applied investigations. Articles, Short Communications, Discussions on previously published papers, and invitation-based Reviews are published bimonthly. The maximum length of an article is 30 pages, including equations, figures and tables
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