{"title":"Experimental and numerical analysis of porous metal foam effect on heat sink under impingement flow","authors":"Moein Safari Ghaleh, Mehrad Paknezhad, Maysam Saidi","doi":"10.1016/j.tsep.2025.104156","DOIUrl":null,"url":null,"abstract":"<div><div>The rise in power density and the shrinking size of electronic components have made efficient thermal management an essential aspect of design. Present study uniquely explores the thermal and hydraulic performance of three different heat sink designs: plate-fin, porous metal foam, and hybrid of finned metal foam, using both experimental and numerical methods under the same impingement cooling conditions. The innovation of this study is its thorough evaluation of these designs using the Local Thermal Non-Equilibrium (LTNE) method to precisely simulate heat transfer within porous materials. Key metrics such as Nusselt number, and pressure drop were assessed. The findings reveal that both porous and hybrid heat sinks surpass the traditional plate-fin design, with the hybrid model showing the highest thermal efficiency due to its larger effective surface area and improved flow disruption. Experimental results indicate that utilizing a hybrid heat sink and metal foam at an input power of 30 W increases the average Nusselt number by 35.82 % and 24.79 %, respectively, compared to the plate-fin heat sink, which, according to the numerical results, these values are 34.76 % and 20.65 %, respectively. These results provide valuable insights for designing advanced thermal management systems for compact electronic devices. The Figure of Merit (FOM) is determined by simultaneously considering both thermal and hydraulic performance. the average FOM for the hybrid and metal foam heat sinks increases by 32.62 % and 19.47 %, respectively, relative to the plate-fin configuration. An increase in the Nusselt number and enhancement of the FOM in heat sinks lead to improved heat transfer efficiency and better protection of electronic components against thermal stress. The effects of input power, interfacial area density, and interfacial heat transfer coefficient are also examined.</div></div>","PeriodicalId":23062,"journal":{"name":"Thermal Science and Engineering Progress","volume":"67 ","pages":"Article 104156"},"PeriodicalIF":5.4000,"publicationDate":"2025-09-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Thermal Science and Engineering Progress","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S2451904925009473","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENERGY & FUELS","Score":null,"Total":0}
引用次数: 0
Abstract
The rise in power density and the shrinking size of electronic components have made efficient thermal management an essential aspect of design. Present study uniquely explores the thermal and hydraulic performance of three different heat sink designs: plate-fin, porous metal foam, and hybrid of finned metal foam, using both experimental and numerical methods under the same impingement cooling conditions. The innovation of this study is its thorough evaluation of these designs using the Local Thermal Non-Equilibrium (LTNE) method to precisely simulate heat transfer within porous materials. Key metrics such as Nusselt number, and pressure drop were assessed. The findings reveal that both porous and hybrid heat sinks surpass the traditional plate-fin design, with the hybrid model showing the highest thermal efficiency due to its larger effective surface area and improved flow disruption. Experimental results indicate that utilizing a hybrid heat sink and metal foam at an input power of 30 W increases the average Nusselt number by 35.82 % and 24.79 %, respectively, compared to the plate-fin heat sink, which, according to the numerical results, these values are 34.76 % and 20.65 %, respectively. These results provide valuable insights for designing advanced thermal management systems for compact electronic devices. The Figure of Merit (FOM) is determined by simultaneously considering both thermal and hydraulic performance. the average FOM for the hybrid and metal foam heat sinks increases by 32.62 % and 19.47 %, respectively, relative to the plate-fin configuration. An increase in the Nusselt number and enhancement of the FOM in heat sinks lead to improved heat transfer efficiency and better protection of electronic components against thermal stress. The effects of input power, interfacial area density, and interfacial heat transfer coefficient are also examined.
期刊介绍:
Thermal Science and Engineering Progress (TSEP) publishes original, high-quality research articles that span activities ranging from fundamental scientific research and discussion of the more controversial thermodynamic theories, to developments in thermal engineering that are in many instances examples of the way scientists and engineers are addressing the challenges facing a growing population – smart cities and global warming – maximising thermodynamic efficiencies and minimising all heat losses. It is intended that these will be of current relevance and interest to industry, academia and other practitioners. It is evident that many specialised journals in thermal and, to some extent, in fluid disciplines tend to focus on topics that can be classified as fundamental in nature, or are ‘applied’ and near-market. Thermal Science and Engineering Progress will bridge the gap between these two areas, allowing authors to make an easy choice, should they or a journal editor feel that their papers are ‘out of scope’ when considering other journals. The range of topics covered by Thermal Science and Engineering Progress addresses the rapid rate of development being made in thermal transfer processes as they affect traditional fields, and important growth in the topical research areas of aerospace, thermal biological and medical systems, electronics and nano-technologies, renewable energy systems, food production (including agriculture), and the need to minimise man-made thermal impacts on climate change. Review articles on appropriate topics for TSEP are encouraged, although until TSEP is fully established, these will be limited in number. Before submitting such articles, please contact one of the Editors, or a member of the Editorial Advisory Board with an outline of your proposal and your expertise in the area of your review.