Shi Li , Xian-wen Ran , Wei-feng Cui , Duo Zhang , Wen-hui Tang
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引用次数: 0
Abstract
This research aims to further investigate the motion law of the sonic underexpansion transient jet and vortex ring. The functional relationship between the dimensionless peak velocity (U∗) of the jet at the center of the nozzle and the incident shock wave Mach number (Ms) is constructed. The vortex ring translate velocity (U) equation is also optimized. Three Ms including Ms = 1.414, 1.479, 1.547 are set to generate sonic underexpansion transient jet and vortex ring, and the corresponding simulations and experiments are carried out. The results show that the theoretical calculations of U∗ and U are in good agreement with the simulations. The increase in Ms results in an increase in the diameter, circulation, vortex ring translate velocity and transient jet velocity (u). The vortex ring motion process is divided into growth, pinch-off, and decay stages. In the growth stage, the vortex ring circulation grows rapidly, but its growth rate gradually decreases. The vortex ring exhibits a higher circulation growth rate at higher Ms. At the decay stage, the decay rate of vortex ring circulation is very slow compared to the growth rate during the growth stage. This indicates that the vortex ring has a strong anti-decay ability.
期刊介绍:
Vacuum is an international rapid publications journal with a focus on short communication. All papers are peer-reviewed, with the review process for short communication geared towards very fast turnaround times. The journal also published full research papers, thematic issues and selected papers from leading conferences.
A report in Vacuum should represent a major advance in an area that involves a controlled environment at pressures of one atmosphere or below.
The scope of the journal includes:
1. Vacuum; original developments in vacuum pumping and instrumentation, vacuum measurement, vacuum gas dynamics, gas-surface interactions, surface treatment for UHV applications and low outgassing, vacuum melting, sintering, and vacuum metrology. Technology and solutions for large-scale facilities (e.g., particle accelerators and fusion devices). New instrumentation ( e.g., detectors and electron microscopes).
2. Plasma science; advances in PVD, CVD, plasma-assisted CVD, ion sources, deposition processes and analysis.
3. Surface science; surface engineering, surface chemistry, surface analysis, crystal growth, ion-surface interactions and etching, nanometer-scale processing, surface modification.
4. Materials science; novel functional or structural materials. Metals, ceramics, and polymers. Experiments, simulations, and modelling for understanding structure-property relationships. Thin films and coatings. Nanostructures and ion implantation.