Advancements in copper and silver sintering as interconnect materials in electronics applications: review

Abstract

As technology advances toward electric vehicles (EVs), copper and silver are receiving growing attention due to their exceptional mechanical, electrical, and thermal properties. These materials withstand high temperatures and offer cost advantages over traditional solders. This review uniquely consolidates recent findings (2010–2024) on sintered Cu and Ag joints, emphasizing not only conventional sintering parameters such as particle shape, size, pressure, time, temperature, and environment, but also emerging aspects that have been overlooked in prior reviews. It offers an in-depth analysis of oxidation effects and prevention strategies, highlights how porosity and density impact mechanical reliability, and examines thermal characteristics such as conductivity, resistivity, and expansion. Unlike earlier surveys, this study critically assesses long-term reliability under thermal cycling, shock, and aging, and investigates mechanical reinforcement using carbon allotropes and metallic dopants. A distinguishing feature is the comparative evaluation of in-house versus commercial sinter pastes, focusing on their composition, organic additives, and fabrication routes. Overall, this work identifies evolving trends and future directions for high-performance interconnects in EVs and power electronics.