Effect of annealing temperature-dependent structural, morphological, optical, and electrical properties of hybrid perovskite-based solar cells: experimental and simulation approach
IF 2.8 4区 工程技术Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
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引用次数: 0
Abstract
In the field of photovoltaic technology, perovskite solar cells are gaining increasing recognition for their unique qualities. The main topic of this research is the effect of the annealing temperatures, such as 80 °C, 100 °C, and 120 °C, on the growth of perovskite CH3NH3PbI3. A sol–gel method, combined with dip coating, has been used to synthesize methyl ammonium lead iodide (CH3NH3PbI3). The resulting films have been characterized using X-ray Diffraction (XRD), Raman spectroscopy, scanning electron microscopy (SEM), energy dispersive X-ray analysis (EDS), UV–Vis spectrophotometry, and the four-point probes method to identify the optimal temperature for the formation of the films. The XRD revealed a tetragonal structure in all perovskite films. These films have a direct bandgap of about 1.56 eV. Subsequently, using the experimental results, we have studied the characteristics of the perovskite solar cells (PSCs) with ITO/ZnMgO/MAPbI3/GO/Au structure employing a solar cell capacity simulator (SCAPS 1D). The thicknesses, defects, acceptor densities, interface defects, and temperature were analyzed and optimized. An efficiency of 23.16% was achieved with the ITO/ZnMgO (100 nm)/MAPbI3 (300 nm)/GO (280 nm)/Au structure. Our findings represent a significant advancement in experimental and simulation research for solar applications.
期刊介绍:
The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.