{"title":"Overcoming intermediate temperature brittleness in L12-strengthened NiCoCr-based high-entropy alloys via phase engineering strategy","authors":"Zhuqun Zhang, Jingyu Pang, Yitong Yang, Zhenqiang Xing, Long Zhang, Yuan Sun, Aimin Wang, Hongwei Zhang","doi":"10.1016/j.jallcom.2025.184172","DOIUrl":null,"url":null,"abstract":"High-entropy alloys (HEAs) have garnered significant attention due to their exceptional high-temperature mechanical properties. However, L1<sub>2</sub>-strengthened HEAs commonly suffer from intermediate temperature brittleness (ITB) at 700~800 ℃, severely limiting their engineering applications. This study proposes an innovative phase engineering strategy that successfully eliminates ITB by regulating the morphology and distribution of topologically close-packed (TCP) phases through thermomechanical processing. The designed processing route enables chain-like precipitation of nanoscale TCP phases that pin grain boundaries while preserving nano-sized L1<sub>2</sub> precipitates for matrix strengthening. Compared to the as-cast HEA, the thermomechanically processed (RAA) HEA demonstrates significantly enhanced mechanical properties at 750 ℃, with YS increasing from 716<!-- --> <!-- -->MPa to 863<!-- --> <!-- -->MPa and elongation improving from 2.8% to 13.1%. Notably, the elongation of RAA HEA increases from 5% to 23.7% with negligible strength loss at 800 ℃. Microstructural analysis reveals that chain-like TCP phases effectively suppress intergranular crack propagation, while dynamic recrystallization mitigates stress concentration, synergistically enhancing intermediate-temperature ductility. Additionally, deformation mechanism analysis reveals that low stacking fault energy promotes the formation of stacking faults, Lomer-Cottrell locks, and deformation twins, which maintain high-temperature strength via the dynamic Hall-Petch effect. This study proposes a counterintuitive approach that utilizes traditionally detrimental TCP phases to improve the ITB of HEAs, offering a different perspective for solving ITB through interface phase engineering strategies.","PeriodicalId":344,"journal":{"name":"Journal of Alloys and Compounds","volume":"28 1","pages":""},"PeriodicalIF":6.3000,"publicationDate":"2025-10-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Alloys and Compounds","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1016/j.jallcom.2025.184172","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"CHEMISTRY, PHYSICAL","Score":null,"Total":0}
引用次数: 0
Abstract
High-entropy alloys (HEAs) have garnered significant attention due to their exceptional high-temperature mechanical properties. However, L12-strengthened HEAs commonly suffer from intermediate temperature brittleness (ITB) at 700~800 ℃, severely limiting their engineering applications. This study proposes an innovative phase engineering strategy that successfully eliminates ITB by regulating the morphology and distribution of topologically close-packed (TCP) phases through thermomechanical processing. The designed processing route enables chain-like precipitation of nanoscale TCP phases that pin grain boundaries while preserving nano-sized L12 precipitates for matrix strengthening. Compared to the as-cast HEA, the thermomechanically processed (RAA) HEA demonstrates significantly enhanced mechanical properties at 750 ℃, with YS increasing from 716 MPa to 863 MPa and elongation improving from 2.8% to 13.1%. Notably, the elongation of RAA HEA increases from 5% to 23.7% with negligible strength loss at 800 ℃. Microstructural analysis reveals that chain-like TCP phases effectively suppress intergranular crack propagation, while dynamic recrystallization mitigates stress concentration, synergistically enhancing intermediate-temperature ductility. Additionally, deformation mechanism analysis reveals that low stacking fault energy promotes the formation of stacking faults, Lomer-Cottrell locks, and deformation twins, which maintain high-temperature strength via the dynamic Hall-Petch effect. This study proposes a counterintuitive approach that utilizes traditionally detrimental TCP phases to improve the ITB of HEAs, offering a different perspective for solving ITB through interface phase engineering strategies.
期刊介绍:
The Journal of Alloys and Compounds is intended to serve as an international medium for the publication of work on solid materials comprising compounds as well as alloys. Its great strength lies in the diversity of discipline which it encompasses, drawing together results from materials science, solid-state chemistry and physics.