Temporal Dynamics of GHz Acoustic Waves in Chipscale Phononic Integrated Circuits

IF 3.1 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
A. Fahad Malik;Mahmut Bicer;Krishna C. Balram
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引用次数: 0

Abstract

Phononic integrated circuits, which manipulate GHz-frequency acoustic fields in $\mathrm {~ {\mu }\text {m}}$ -scale waveguides, provide new degrees of freedom for routing and manipulation of microwaves in deeply sub-wavelength geometries with associated implications for chipscale sensing and signal processing. The combination of low propagation loss, long interaction lengths and slow speed of sound put together with the large measurement bandwidths and high frequency resolution available from modern vector network analyzers (VNA) makes it feasible to visualize the temporal dynamics of propagating acoustic fields in these devices and see the device in action. Two representative examples we discuss here are pulse circulation and ringdown in an acoustic microring resonator, and the observation of (parasitic) multipath interference effects in waveguide resonator geometries. In the absence of fast 3D acoustic field imaging modalities, such time domain reflectometry based methods provide a viable alternative for mapping interface reflection and loss, which becomes increasingly critical as these devices start to scale in complexity.
芯片级声子集成电路中GHz声波的时间动力学
声子集成电路在$\ mathm {~ {\mu}\text {m}}$尺度波导中操纵ghz频率声场,为深度亚波长几何结构中的微波路由和操作提供了新的自由度,并对芯片级传感和信号处理具有相关意义。低传播损耗、长相互作用长度和慢声速,再加上现代矢量网络分析仪(VNA)提供的大测量带宽和高频率分辨率,使这些设备中传播声场的时间动态可视化和观察设备的运行成为可能。我们在这里讨论的两个代表性例子是声微环谐振器中的脉冲循环和衰荡,以及波导谐振器几何形状中(寄生)多径干涉效应的观察。在缺乏快速3D声场成像模式的情况下,这种基于时域反射法的方法为绘制界面反射和损耗提供了可行的替代方法,随着这些设备的复杂性开始扩大,这种方法变得越来越重要。
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来源期刊
Journal of Microelectromechanical Systems
Journal of Microelectromechanical Systems 工程技术-工程:电子与电气
CiteScore
6.20
自引率
7.40%
发文量
115
审稿时长
7.5 months
期刊介绍: The topics of interest include, but are not limited to: devices ranging in size from microns to millimeters, IC-compatible fabrication techniques, other fabrication techniques, measurement of micro phenomena, theoretical results, new materials and designs, micro actuators, micro robots, micro batteries, bearings, wear, reliability, electrical interconnections, micro telemanipulation, and standards appropriate to MEMS. Application examples and application oriented devices in fluidics, optics, bio-medical engineering, etc., are also of central interest.
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